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Wednesday 30 October 2024
Hon Precision secures orders from top US CSPs, riding the CoWoS growth wave
Hon Precision, Inc. (HPI), based in Taiwan, will be listed on the Emerging Stock Board (ESB) on October 31. The company, which specializes in backend semiconductor test handlers and...
Wednesday 30 October 2024
TSMC faces the localization test amid globalization's waning influence
On October 26th, the TSMC "family" gathered for its annual sports day, with founder Morris Chang calling it his favorite day of the year. Hosting for the first time, Chairman C.C...
Wednesday 30 October 2024
OpenAI, Broadcom working to develop AI inference chip
OpenAI is working with Broadcom Inc. to develop a new artificial intelligence chip specifically focused on running AI models after they've been trained, according to two people familiar...
Wednesday 30 October 2024
CIS packaging firm Tong Hsing projects seasonal decline in 4Q24, cautious growth outlook for 2025
The semiconductor packaging specialist and Yaego Group affiliate Tong Hsing Electronics reported that seasonal patterns in 2024 have differed from previous years, with revenue remaining...
Wednesday 30 October 2024
PTI leverages FOPLP and HBM momentum as AI revenue share grows
Powertech Technology (PTI), a backend service provider, anticipates that orders for AI device applications will constitute a larger portion of the company's revenue. This is attributed...
Tuesday 29 October 2024
South Korean expat detained in China over alleged semiconductor espionage under new spy law
A South Korean expatriate has been arrested and detained in China on suspicion of engaging in espionage activities, marking the first arrest of a South Korean national since the implementation...
Tuesday 29 October 2024
Intel's US fab ambitions clash with election-year politics
In July 2022, Congress passed the CHIPS and Science Act, the largest-ever federal funding package for semiconductor manufacturing—a milestone Intel CEO Pat Gelsinger has devoted...
Tuesday 29 October 2024
Can Samsung, Intel rise above challenges? Different strategies for IDM, pure foundry models
The third quarter financial results for both Samsung Electronics (Samsung) and Intel are set to be released on October 31, 2024. The outcome likely hinges on how well their management...
Tuesday 29 October 2024
Onsemi reports steady 3Q24 results amid cooling markets, cautious for 2024 and 2025
On Semiconductor's (Onsemi) latest financial results met expectations despite challenging market conditions. The company also offered a cautious outlook for 2024 and 2025.
Tuesday 29 October 2024
TSMC's go-to partner for AI demand: ASE's SPIL invests US$13 million to boost CoWoS capacity
TSMC is strengthening its partnerships with OSAT providers, outsourcing key stages of its CoWoS packaging technology. ASE's subsidiary Siliconware Precision Industries (SPIL) has...
Tuesday 29 October 2024
Japanese companies develop 3D analog IC for ADAS, overcoming cost and technical challenges
Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei.
Tuesday 29 October 2024
China begins tightening rare earth supply
The Chinese government has significantly tightened restrictions on foreign companies, especially semiconductor manufacturers, making it much more difficult to acquire various rare...
Tuesday 29 October 2024
TSMC intends to expand AP8 by acquiring nearby facilities from Innolux, say sources
TSMC, which acquired Innolux's 5.5G LCD fab in Tainan (southern Taiwan) in August, intends to acquire additional Innolux facilities that are adjacent to the one it has already acquired,...
Monday 28 October 2024
Can Intel and Samsung unite to challenge TSMC's foundry throne?
South Korea's Maeil Business Newspaper recently reported that Intel CEO Pat Gelsinger is seeking a face-to-face meeting with Samsung Electronics Chairman Jae-yong Lee to...
Monday 28 October 2024
Intel expands Chengdu facility with new server chip packaging and testing services
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research