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Monday 2 December 2024
Intel announces departure of CEO Pat Gelsinger
Intel CEO Pat Gelsinger has retired from the company following a distinguished 40-plus-year career and has resigned from the board of directors, effective December 1, 2024.
Monday 2 December 2024
TSMC evolves CoWoS technology, to challenge 9x reticle sizes in 2027
TSMC announced at the Open Innovation Platform (OIP) Ecosystem Forum in Europe that its CoWoS packaging technology will achieve certification by 2027, introducing a version with 9x...
Monday 2 December 2024
United, we thrive: Mitsubishi Electric aims to restructure Japan's power semiconductor sector
Mitsubishi Electric President and CEO, Kei Uruma, revealed in a Tokyo interview that the company is pursuing a restructuring initiative within Japan's power semiconductor sector,...
Monday 2 December 2024
DeepX AI chip achieves up to 90% yield with Samsung's 5nm process
South Korean AI chip startup DeepX is in the final stages of preparation for its first mass-produced chips. Through Samsung Electronics' foundry division, the company has achieved...
Monday 2 December 2024
Weekly news roundup: SMIC leads China's semiconductor rise as memory makers gain ground
Semiconductor Week in Review (Nov 24 - 30) :
Monday 2 December 2024
Taiwan weighs overseas science parks to tackle talent and resource challenges
Amid mounting pressures on talent and resources, Taiwan is looking to widen its horizons abroad, exploring the possibility of establishing science parks beyond its borders as part...
Monday 2 December 2024
China's domestic chip equipment push threatens South Korean manufacturers
Due to US sanctions, China has been unable to acquire advanced semiconductor manufacturing equipment and is now shifting its focus toward mature processes. Although this shift has...
Monday 2 December 2024
Rohm, Valeo team up for next-gen power electronics
Rohm Semiconductor and Valeo have jointly announced a collaboration to design and develop the next generation of power modules for electric motor inverters, combining their expertise...
Monday 2 December 2024
Taiwan expands science parks to strengthen industrial clusters
Taiwan's Minister of Economic Affairs J.W. Kuo announced plans for TSMC to construct a new domestic plant annually. The ministry is actively preparing water and electricity infrastructure...
Monday 2 December 2024
Trump's America First raises stakes for TSMC's advanced processes
President-elect Donald Trump, who will take office on January 20, 2025, has voiced strong criticism of the Biden administration's CHIPS Act subsidies. His America First policy is...
Monday 2 December 2024
Intel balances US subsidies with renewed China commitment
On November 26, Intel Connection China, hosted in Chengdu, emerged as the company's largest technology ecosystem event to date, featuring participation from major partners including...
Friday 29 November 2024
German government plans about EUR2 Billion in new chip subsidies
The German government is preparing billions of euros of new investments into the nation's semiconductor industry, two months after Intel Corp. href="https://www.bloomberg.com/news/articles/2024-09-17/germany-faces-fresh-setback-as-intel-halts-planned-chip-factory"...
Friday 29 November 2024
Samsung's semiconductor personnel reform appears unconventional but may still struggle with bureaucracy
Samsung Electronics is undergoing a personnel reform in response to the crisis within its semiconductor business. Notably, the head of Device Solutions (DS), Young-Hyun Jun, will...
Friday 29 November 2024
Samsung Foundry's uncertain future: What path should it take?
Amid challenges, Samsung has decided to scale back investments in its foundry business, prioritizing existing production lines to reduce losses and refocusing efforts on regaining...
Friday 29 November 2024
Qualcomm-Intel deal speculation fizzles out
Qualcomm is unlikely to pursue any transactions with Intel, a decision that aligns with industry expectations. Sources close to the semiconductor supply chain suggest Qualcomm never...