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Wednesday 9 July 2025
IBM taps Samsung's 5nm process for Spyre AI chip in new Power11 servers
IBM has introduced its latest Power11 enterprise servers in Germany, featuring the Spyre accelerator chip designed for AI inference. The chip is manufactured using Samsung Electronics'...
Wednesday 9 July 2025
South Korea's Hana cracks TGV glass substrate market with eye on AI chip boom
Hana Technology, a South Korean equipment maker formerly focused on battery solutions, has developed core Through Glass Via (TGV) technology for semiconductor glass substrates, signaling...
Wednesday 9 July 2025
TSMC's GaN market exit creates opening for Samsung, Asian chip race rage on
TSMC's recent decision to phase out its gallium nitride (GaN) foundry business is sending ripples through the compound semiconductor industry, opening the door for new contenders...
Wednesday 9 July 2025
Ex-SEMI China head leads E-Town Semiconductor to explosive STAR Market debut
Beijing E-Town Semiconductor Technology Co., Ltd. (E-Town), a Chinese supplier of semiconductor manufacturing equipment, went public on the Shanghai STAR Market on July 8, 2025. The...
Wednesday 9 July 2025
T-Glass shortage chokes CoWoS substrate supply, Nittobo delays ramp-up
Since the end of 2024, a critical shortage of T-Glass has been disrupting the global supply chain for advanced chip packaging. This specialized glass fabric, prized for its low thermal...
Wednesday 9 July 2025
Topco Scientific reports record 2Q25, 1H25 sales, driven by demand from advanced semiconductor processes
Topco Scientific has reported record sales for both the second quarter and first half of 2025, driven mainly by demand for semiconductor materials supporting advanced manufacturing...
Wednesday 9 July 2025
MA-Tek and MSScorps hit record-high June revenues
Semiconductor testing and analysis companies had delivered strong June financial results with Material Analysis Technology (MA-Tek) and MSScorps both achieving new monthly revenue...
Wednesday 9 July 2025
Intel halts in-house glass substrate development as Tan avoids 'R&D trap'
Glass substrates are considered one of the key directions for advanced packaging development, especially showing significant potential in high-performance computing (HPC) and data...
Wednesday 9 July 2025
GlobalFoundries goes full-stack on AI chips with MIPS buy
GlobalFoundries has announced an agreement to acquire MIPS, a supplier of AI and processor intellectual property (IP). The acquisition aims to broaden GlobalFoundries' customizable...
Wednesday 9 July 2025
Intel cuts over 500 jobs in Oregon as part of layoff plan
Intel Corp. is cutting more than 500 positions in Oregon as part of a layoff plan that's ultimately expected to affect roughly 20% of the chipmaker's staff.
Wednesday 9 July 2025
Rockchip sees 1H25 profit tripling on China's AIoT gold rush

Rockchip Electronics projects a sharp jump in first-half 2025 net profit, forecasting a year-on-year increase of 185% to 195% to reach...

Wednesday 9 July 2025
Hanmi's HBM4 tools go live, but is 2029 too late for hybrid bonding?
Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads...
Tuesday 8 July 2025
US-China semiconductor standoff sees tactical shifts as rare earths and EDA tools enter the fray

Industry insiders said US-China relations have been flammable ever since the trade war ignited, especially in the high-stakes arena of...

Tuesday 8 July 2025
Samsung, LG earnings slide amid trade pressures despite tariff deal with Vietnam
Samsung Electronics and LG Electronics, South Korea's two largest electronics manufacturers, are experiencing a modest reprieve after the US and Vietnam agreed to sharply lower reciprocal...
Tuesday 8 July 2025
Intel repositions chip strategy, scales back 18A in favor of 14A

Intel's once-touted 18A chipmaking process, which former CEO Pat Gelsinger emphasized as a critical factor for surpassing competitor TSMC...