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Friday 4 July 2025
SEMICON Taiwan 2025 to launch AI chip packaging alliance, highlighting advanced packaging and ecosystem resilience
SEMICON Taiwan 2025 is scheduled to take place from September 10 to 12 at the Taipei Nangang Exhibition Center, with a series of technical forums kicking off on September 8. A key...
Friday 4 July 2025
Renesas ditches SiC to focus on MCU, GaN products for AI sector
Japanese semiconductor firm Renesas has halted mass production of silicon carbide (SiC) power semiconductors and will now launch new products including microcontroller units (MCU)...
Friday 4 July 2025
Pegatron chair warns Taiwan's chip edge hinges on 3 critical fixes
Pegatron Chairman T.H. Tung, speaking as President of the Monte Jade Science & Technology Association of Taiwan at the Yushan–KPMG Technology Forum on July 2, highlighted...
Friday 4 July 2025
Infineon targets 4Q25 for 12-inch GaN sample rollout as scaling accelerates
Infineon Technologies AG has announced progress in its scalable gallium nitride (GaN) semiconductor manufacturing using 12-inch wafers, aiming to supply customer samples by the fourth...
Friday 4 July 2025
TSMC, suppliers ride AI wave as Nvidia GB series powers record demand

Taiwan's semiconductor and electronics industries are entering a new period of explosive growth, driven by the full-scale rollout of...

Friday 4 July 2025
South Korea cuts reliance on Japanese chip materials, but faces hurdles in advanced technologies
In the high-stakes world of semiconductors, materials are everything. In South Korea, the issue became a national priority after a 2019 trade dispute with Japan sent shockwaves through...
Friday 4 July 2025
Taiwan's Kenmec leverages AI simulation to slash factory build times by three months
Kenmec Mechanical Engineering is using Nvidia's Omniverse platform to transform factory construction, enabling "one-click deployment" that cuts build times by over three months while...
Friday 4 July 2025
Tata and Tower Semiconductor reportedly shortlisted for India's SCL upgrade
Tata Semiconductor and Tower Semiconductor have advanced to the financial bidding stage to modernize the Semiconductor Laboratory (SCL) in Mohali, Mint reports. The shortlisted...
Thursday 3 July 2025
Samsung completes development of 1c DRAM, paving way for HBM4 rollout

Samsung Electronics has successfully developed its sixth-generation DRAM, known as 1c DRAM, built using a 10nm class process. The product...

Thursday 3 July 2025
Details of the US-China trade agreement remain unclear, with no consensus on rare earths and chip controls
On June 26, 2025, US President Donald Trump announced that the US had signed a trade agreement with China on June 25, which was also confirmed by China's Ministry of Commerce. From...
Thursday 3 July 2025
US unleashes Section 232 tariffs, global trade talks in disarray
With the July 9, 2025, deadline for new tariffs fast approaching, trade talks between the US and key partners like Japan, India, and France are showing signs of strain. At the heart...
Thursday 3 July 2025
Intel plans to abandon in-house glass substrate development, shift to external procurement
According to Computerbase, under the leadership of new CEO Lip-Bu Tan, Intel might no longer push forward with in-house R&D of glass substrates but instead turn to purchasing...
Thursday 3 July 2025
Exclusive interview: Superb timing on the release of 'A Chip Odyssey'
Unlike semiconductor manufacturing processes, time is never an element that filmmakers can control. Since its release over three weeks ago, the documentary 'A Chip Odyssey' has accumulated...
Thursday 3 July 2025
Taiwan govt backs US$63 million in Hsinchu science park investments
The National Science and Technology Council (NSTC) approved on July 2, 2025, six investment projects across various science parks in the Hsinchu region, totaling NT$1.83 billion (US$63.3...
Thursday 3 July 2025
Intel looks to 14A to win Apple, Nvidia orders; 18A foundry plans in question
Intel is reportedly reconsidering its foundry strategy under new CEO Lip-Bu Tan, with plans to shift focus from its 18A (1.8nm-class) process node to the next-generation 14A (1.4nm-class)...