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Thursday 31 July 2025
Arm posts solid 1QFY25 results, but rising R&D costs cloud earnings outlook
Arm reported strong fiscal first-quarter results with high margins and steady revenue growth. However, a jump in operating expenses and a cautious outlook on handsets and industrial...
Thursday 31 July 2025
SK Hynix secures top spot as competition heats up in DRAM market
SK Hynix has solidified its position as the global market leader after achieving record performance in the High Bandwidth Memory (HBM) market. However, China's leading memory chipmaker,...
Wednesday 30 July 2025
TSMC's C.C. Wei and Mark Liu receive semiconductor industry's highest honor
The Semiconductor Industry Association (SIA) has named TSMC Chairman and CEO C.C. Wei and former Chairman Mark Liu as co-recipients of the 2025 Robert N. Noyce Award, the semiconductor...
Wednesday 30 July 2025
From substrate to system: A deep dive into Nvidia's CoWoP packaging shift
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
Wednesday 30 July 2025
Japan's Advantest raises FY2025 outlook on strong AI chip demand and weak yen
Japanese chip testing equipment maker Advantest has raised its full-year revenue and earnings forecasts for fiscal 2025, citing stronger-than-expected demand driven by generative...
Wednesday 30 July 2025
Huaqin joins Nexchip board with 6% stake purchase from Powerchip
Nexchip Semiconductor said on July 29 that major shareholder Powerchip Innovation Investment Holdings will transfer a 6% stake — equal to 120,368,109 shares — to Huaqin...
Wednesday 30 July 2025
Samsung accelerates Pyeongtaek P4 to boost 1c DRAM mass production
Samsung Electronics is accelerating the resumption of construction at the fourth phase (PH4) of its Pyeongtaek Campus Line 4 (P4) in South Korea, where construction was halted last...
Wednesday 30 July 2025
IC designers expect limited impact of Section 232 investigations
The US Department of Commerce (DOC) is set to announce the results of the Section 232 investigations within the next two weeks, a potential cornerstone event for chip tariffs. The...
Wednesday 30 July 2025
Taiwan manufacturers adopt three-step survival strategy in response to tariff disruptions and economic downturn
As the US prepares to announce reciprocal tariffs on Taiwan, concerns persist over the potential impact on Taiwanese industries, including exports, technology, and agriculture. If...
Wednesday 30 July 2025
Samsung-Tesla deal gives South Korea new leverage in US tariff negotiations
Samsung has secured a major deal with Tesla, creating new opportunities for its foundry business and providing leverage in South Korea-US tariff negotiations. The partnership extends...
Wednesday 30 July 2025
Tesla AI chip deal marks dawn of Samsung's foundry comeback
Samsung Electronics has landed a next-generation AI chip order from Tesla, a deal seen as a potential inflection point for its lagging foundry business. The deal involves Tesla's...
Wednesday 30 July 2025
VIS expects continued gross margin pressure in 3Q25
Specialty IC foundry Vanguard International Semiconductor (VIS) announced its latest financial results on July 29, reporting a second-quarter 2025 consolidated revenue of NT$11.7...
Wednesday 30 July 2025
Samsung chairman heads to Washington as Musk backs chip pact amidst tariff standoff
Samsung Electronics Chairman Lee Jae-yong departed for Washington, DC, on July 29 in a bid to bolster South Korea's final efforts to avert a 25% reciprocal tariff from the US. The...
Wednesday 30 July 2025
Samsung likely to ramp Tesla chip production in 2028 and peak in 2029-2032, says DIGITIMES analyst
DIGITIMES analyst Luke Lin says Samsung's Tesla deal marks a pivotal entry into the US advanced foundry market. He projects AI6 high-volume production from 2028, with peak...
Wednesday 30 July 2025
PTI overcomes awkward phase with FOPLP, expects major growth from 2026
Memory packaging and testing company Powertech Technology Inc. (PTI) has heavily invested in fan-out panel-level packaging (FOPLP) in recent years. Chairman DK Tsai stated that the...