At the OktoberTech Taipei event held on September 11, 2025, Infineon Technologies AG unveiled key developments in its automotive electronics portfolio, with CEO Jochen Hanebeck and...
US Commerce Secretary Howard Lutnick expressed optimism on September 11, 2025, that a significant trade deal with Taiwan is within reach, raising hopes that temporary tariffs on Taiwanese...
Intel has confirmed to South Korean media that it will proceed with its semiconductor glass substrate commercialization plans as originally outlined, dismissing reports of potential...
TSMC's plant in Kumamoto, Japan, is fueling deeper investment ties between Kyushu and Taiwan. On September 10, 15 semiconductor suppliers from Fukuoka and Kumamoto exhibited at SEMICON...
Nitto Denko has entered a joint development agreement with IBM to explore advanced packaging technologies and materials for semiconductor applications. The partnership will focus...
Taiwan's Minister of Economic Affairs Kung Ming-hsin, on September 10, 2025, declined to comment on an alleged trade secret theft targeting TSMC's 2nm process technology amid concerns...
Since the beginning of 2025, despite disruptions from US President Donald Trump's trade protectionism, the AI wave has driven American cloud service providers (CSPs) to continuously...
The Southern Taiwan Science Park (STSP) has continued to see its output value climb to new highs each year, underscoring its role as a key hub in the global semiconductor supply chain...
Jochen Hanebeck, CEO of Infineon, emphasized the concept "no AI without power" during his keynote speech at the SEMICON Taiwan 2025 Master Forum. Power semiconductors play a critical...
Renowned chip architect Jim Keller was invited to speak at the SEMICON Taiwan 2025 Master Forum. At the start of his speech, Keller announced that his company, Tenstorrent, will establish...
Fan-out panel-level packaging (FOPLP) is poised to become the next-generation advanced packaging technology, driving industry competition and research investment. Leading outsourced...
Merck has pointed out that the semiconductor industry's growth curve has reached a combined output value of EUR650 billion (US$760.4 billion) and is expected to surpass EUR1 trillion...
ACM Research (Shanghai), Inc., dual-listed in the US and China, is maneuvering through Washington's escalating curbs on China's chip industry. Chairman David Wang emphasized that...
In 2024, the Taiwanese government announced the launch of a 10-year NT$300 billion (approx. US$9.89 billion) Taiwan Chip-based Industrial Innovation Program (Taiwan CbI), marking...
At SEMICON Taiwan, four global automotive semiconductor executives—Stefan Yores of Bosch, Jochen Hanebeck of Infineon Technologies, Kurt Sievers of NXP, and Hosoku Takuchi of...
