The number of substrate layers for the next-generation Intel Nehalem-based CPU has been decided, according to industry sources, with 12 layers being the maximum, double the current...
According to Nan Ya Printed Circuit Board (NPC), demand for traditional PCBs and wire-bonding substrates is falling but shipments of flip-chip (FC) substrates remains relatively strong...
The Taiwan Printed Circuit Association's (TPCA's) annual event (TPCA Show 2008) is to be held between October 22-24. 357 exhibitors across 1,634 booths are registered to participate,...
Although the general economy is weak, semiconductor equipment distributor Taiwan Kong King's (TKK's) sales and profits will continue to grow thanks to the capacity expansions of IC...
The launch of second-phase Intel Nehalem-based CPUs (scheduled for the third quarter of 2009) is expected to have a corresponding impact on substrate demand, according to industry...
Taiwan investors forecast that sales for IC substrate makers in the third quarter will have only single-digit growth due to weak demand for wire bonding substrates and PCBs, which...
IC substrate maker Kinsus Interconnect Technology has entered the photovoltaic sector via its recent investment in solar-module maker Lucky Power. Among all major IC substrate makers...
IC substrate supplier Kinsus Interconnect Technology has lowered its revenues forecast for the third quarter to single-digit growth, originally the company was aiming for 10%, because...
Taiwan-based IC substrate suppliers are mostly optimistic about the third quarter, with Nan Ya Printed Circuit Board (NPC) and Kinsus Interconnect Technology expecting strong sequential...
