High-end AI-related products continued to drive revenue growth at PCB maker Zhen Ding Tech (ZDT) in April, with server and optical communication revenue surging more than 230% year...
PCB maker Zhen Ding Technology has launched the second phase of its joint research center with National Tsing Hua University, aiming to deepen collaboration on advanced PCB and IC...
Workloads are shifting from training to inference. In this transition, CPUs are regaining a central role in coordinating diverse computing tasks, significantly boosting their importance...
Taiwan-based PCB maker Zhen Ding Tech has stated that as customers' next-generation product platforms gradually enter mass production starting from the second quarter of 2026, its...
AI GPUs, CPUs, and ASICs are driving demand for increasingly larger sizes and higher layer counts in substrate technology. The supply-demand gap for high-end ABF substrates continues...
Printed circuit board (PCB) giant Zhen Ding Technology held a board meeting on April 17 and approved plans for its subsidiary, Leading Interconnect Semiconductor Technology (LIST),...
High-end ABF substrate wet process equipment maker Eclat Forever Machinery (EF) announced that, driven by clear expansion momentum from domestic IC substrate customers, capital expenditures...
As AI CPUs, GPUs, and application-specific integrated circuits (ASICs) advance to new generations, they are driving a sharp increase in both substrate size and layer counts. Simultaneously,...
Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...
The global AI surge has sharply increased demand for advanced chips, leaving TSMC's CoWoS capacity in tight supply. Intel's advanced packaging strategy is set to reach a critical turning...
As demand for high-speed transmission in AI advanced packaging surges, IC substrate major Unimicron Technology said that high-end ABF substrates required for AI applications are strongly...
Unimicron held an investor conference on 25 February 2026. A day earlier, its board approved the appointment of UMC co-president SC Chien as chairman and group chief strategy officer...
Leading IC substrate maker Unimicron Technology announced that chairman Tzyy-jang Tseng is stepping down upon reaching retirement age. The company said the leadership change was triggered...
Kinsus, the IC substrate arm of Pegatron, has approved additional project-based capital spending totaling NT$23.5 billion (approx. US$744 million) to support ABF substrate equipment...
