Image transfer, also known as photolithography (or simply, lithography), plays a crucial role in defining the circuit patterns on a panel. With photolithography, IC substrate manufacturers...
Innovative IC substrate manufacturer Phoenix Pioneer Technology is undergoing a strategic transformation into advanced packaging. The company is developing cutting-edge xQFN lead...
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Japanese IC substrate manufacturer Ibiden has lowered its overall performance forecast for the fiscal year 2024 (April 2024 to March 2025). Similarly, another IC substrate company,...
The second half of the year is typically a peak season for substrates. Despite market volatility, strong demand for AI continues to drive the global integrated circuit (IC) substrate...
The global advanced IC substrate market is poised for significant growth, according to recent industry reports. Global Information, Inc. (GII) projects the market to reach US$18.11...
Major Taiwan-based PCB and IC substrate companies reported brisk sales performance in August 2024, indicating an increase in demand from generative AI and a ramp-up in orders for...
Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
Printed circuit board (PCB) and IC substrate equipment specialist Group Up Industrial (GP) has stepped up the development of its glass substrate offering, eyeing robust demand for...
Zhen Ding Technology, a Taiwan-based flexible PCB and IC substrate supplier, has seen the development of its new plant in Thailand progress more smoothly than anticipated. The plant...
IC substrate providers have reported improving sales, with suppliers expecting significant growth and enhanced profit margins in the second half of 2024.
Approaching the final quarter of 2024, major PCB and IC substrate manufacturers are expanding operations in Southeast Asia to reduce dependence on Chinese production. Needless to...
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
