Approaching the final quarter of 2024, major PCB and IC substrate manufacturers are expanding operations in Southeast Asia to reduce dependence on Chinese production. Needless to...
Unimicron Technology aims to expand its share of the high-end IC substrate market and surpass Japanese competitors by 2025, according to T. J. Tseng, chairman of the Taiwan-based...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
The market for ABF substrates is unlikely to see shortages return until the first quarter of 2026, according to T. J. Tseng, chairman of Unimicron Technology.
Nan Ya Printed Circuit Board (Nan Ya PCB), one of Taiwan's largest IC substrate suppliers, expects business will pick up in the second half of 2024, after a slow start in the first...
Apple has disclosed its supplier list for fiscal year 2023. Nan Ya PCB, the second-largest provider of IC substrates, re-entered the supply chain after an extended absence.
Taiwan's PCB and IC substrate market will first stagnate before seeing a sharp increase in 2024, according to Maurice Lee, chairman of the Taiwan Printed Circuit Association (TPCA)...
The IC substrate sector is predicted to return to growth in the second half of 2024, with the growth momentum continuing in 2025, according to industry sources.
BT substrate demand has begun to rise, driven by growing demand for mobile phones and memory chips, while ABF substrate demand is expected to pick up in the second half of 2024, according...
Nan Ya PCB, Kinsus Interconnect Technology, and Zhen Ding Technology reported sequential revenue decreases in January of 4.3%, 5.6%, and 13.9%, respectively. Unimicron Technology...
According to industry sources, IC material distributors anticipate customer inventory adjustments will end in the first half of 2024, with AI expected to accelerate growth in the...
