Innolux, a leading company in the panel industry, returned to profitability in the second quarter of 2024, posting a modest profit of NT$1.2 billion. Looking ahead to the third quarter,...

Glass substrates have become a critical strategic element in fan-out panel level packaging (FOPLP), a technology that TSMC and various backend houses are developing. Because of that,...

Although the two major panel manufacturers saw slight declines in revenue in June 2024, the second quarter was overall quite fruitful due to rising panel prices.

Innolux Corporation, a leading display panel manufacturer, is undergoing a significant transformation as it ventures into the semiconductor field with its Fan-Out Panel Level Packaging...

PanelSemi, which was established with the backing of Foxconn founder Terry Gou and invested by panel manufacturer Innolux, has expanded its operations beyond displays to semiconduc...

In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...

Despite a recent weakening in demand for LCD TV panels and a lack of upward momentum in prices, producing panels according to demand is expected to prevent significant price drops...