TSMC is asking suppliers to accelerate the conversion of a plant into a CoWoS advanced packaging fab to meet strong demand from Nvidia, which is depending on the Taiwanese foundry...

AMD has teamed up with Taiwan-based BE Epitaxy Semiconductor Technology and Best Epitaxy Manufacturing for joint development of next-generation silicon photonics (SiPh) technology,...

Innolux is expanding its fan-out panel level packaging (FOPLP) technology focus beyond automotive and power management ICs (PMIC) to include high-end applications.

With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting...

Large-size panel manufacturers, including AUO and Innolux, saw revenue growth in August. AUO, in particular, experienced a significant year-over-year revenue increase due to its merger...