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    NEWS TAGGED IP
    Wednesday 23 April 2025
    Samsung slaps BOE with fresh OLED suit, targeting Nubia, Redmagic phones in cross-border IP clash

    Samsung Display (SDC), South Korea's top panel supplier, has filed a fresh OLED patent infringement lawsuit against China's BOE Technology,...

    Monday 21 April 2025
    Cadence to acquire Arm's Artisan foundation IP business
    According to the official press release, Cadence has announced a definitive agreement to acquire Arm's Artisan foundation IP business, expanding its design IP portfolio and entering...
    Saturday 19 April 2025
    Services under siege: US tech giants face cross-continental blowback
    As the US-China tariff standoff intensifies, Beijing is signaling a strategic pivot—redirecting retaliation from goods to services and placing America's tech-heavy service sector...
    Friday 18 April 2025
    Murata's global patent blitz targets Maxscend, threatens China's TF-SAW exports

    China's RF chip sector is facing a major disruption as Murata Manufacturing files five patent lawsuits against Maxscend Technologies...

    Saturday 12 April 2025
    As US tariffs escalate, China explores countermeasures targeting tech and IP
    The trade conflict between the US and China has intensified, with the US recently announcing an increase in tariffs on Chinese goods to 125%. This move is seen as a reaffirmation...
    Wednesday 2 April 2025
    GUC announces tape-out of the world's first HBM4 IP on TSMC N3P
    Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out the world's first HBM4 controller and PHY IP. This test chip was implemented...
    Monday 31 March 2025
    Interview with Ceva CEO: Neural networks gradually replacing traditional DSP; targeting edge AI in the IP market
    IP provider Ceva has been actively entering the edge AI sector in recent years. In an interview with DIGITIMES, CEO Amir Panush stated that edge AI presents significant market...
    Friday 28 March 2025
    Primarius to acquire Actt, accelerating China's EDA consolidation
    Primarius Technologies, a Chinese electronic design automation (EDA) company that is publicly traded, announced on March 27 that it would acquire equity in Chengdu Analog Circuit...
    Friday 28 March 2025
    SK Hynix completes final acquisition, obtains Intel's NAND IP
    SK Hynix has completed the full acquisition of Intel's NAND Flash division, concluding a four-year process. The assets will be integrated under Solidigm, SK Hynix's US subsidiary,...
    Tuesday 25 March 2025
    Nvidia expands ASIC footprint through MediaTek NVLink deal
    MediaTek announced at this year's GTC conference that it will deepen its partnership with Nvidia by integrating NVLink IP into its ASIC services. Industry sources suggest this partnership...
    Friday 21 March 2025
    Malaysian IC design houses awaiting details of Arm deal
    The Malaysian government recently announced a technology licensing agreement worth US$250 million with silicon intellectual property (IP) powerhouse Arm. The deal aims to assist the...
    Thursday 13 March 2025
    GUC announces successful launch of industry's first 32G UCIe silicon on TSMC 3nm and CoWoS technology
    Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
    Thursday 13 March 2025
    China reportedly to boost RISC-V adoption despite challenges replacing x86 and Arm
    Recent reports indicate that China plans to issue guidance encouraging nationwide use of RISC-V chips for the first time. The plan will reportedly be drafted by eight relevant departments...
    Thursday 6 March 2025
    Marvell demos 2nm silicon IP, developed with TSMC
    Marvell Technology has unveiled its first 2nm silicon IP for advanced AI and cloud infrastructure. The silicon, fabricated using TSMC's 2nm process, is integral to the Marvell platform...
    Tuesday 4 March 2025
    Enosemi and Jabil form alliance to advance photonic chip packaging
    In a landmark announcement on March 3, Enosemi and Jabil unveiled a sophisticated collaboration to pioneer advanced packaging process technology for Enosemi's cutting-edge photonic...
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