SiFive is seeing the golden opportunity to grow RISC-V adoption in the embedded solutions IP market while its competitor voluntarily retreats from the market.
Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...
Synopsys Users Group (SNUG) Taiwan 2024 demonstrated the state-of-the-art EDA innovations and Artificial intelligence (AI) driven solutions for the chip design community.
With the intensifying competition in the AI memory chip market, leading memory vendors like SK Hynix, Micron Technology, and Samsung Electronics are gearing up for proxy patent battles...
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tape-outs.
After announcing its foray into the LLM (Large Language Model) IP market, Skymizer recently unveiled a series of hardware and software solutions centered around LLM IP.
Skymizer, a prominent Taiwan-based AI system software provider known for its compiler optimization solutions, has announced the release of EdgeThought, its new software-hardware co-design...
AI compilers service provider, Skymizer has announced a strategic pivot by launching the ET2 LPU chip hardware IP and the Skymizer LLM System platform, entering the chip IP solutions...
IC design house Egis Technology (EgisTec) has stepped up its deployment in the IP and IC design service sector, looking to capitalize on the potential of the AIoT market.
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan...
Alcor Micro, an IC design subsidiary of Egis Technology Group, is shifting its focus to the ASIC and IP industries after acquiring StarRiver Semiconductor, with efforts expected to...
To drive the technologies and products of the future, creative companies rely on end-to-end solutions across chips, IPs, packages, PCBs, and systems to meet strict design requirements...
