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NEWS TAGGED IP
Thursday 27 January 2022
Andes RISC-V SoC shipments top 3 billion units in 2021
Shipments for SoC chips adopting Andes Technology's processor IPs topped three billion units in 2021, representing a 2017-2021 CAGR of 50%, according to Frankwell Lin, chairman and...
Monday 24 January 2022
Unisoc adopts Imagination NNA IP in new 5G smartphone chips
China's fabless chipmaker Unisoc has used Imagination's Series3NX neural network accelerator (NNA) IP in its Tanggula T770 and T760 system-on-chips (SoC) for 5G smartphones, according...
Friday 24 December 2021
South Korean chip designers pressured by semiconductor IP price hike
The continuing price hike of overseas semiconductor intellectual property (IP) could force small- and medium-sized IC design houses in South Korea to give up cutting-edge process...
Wednesday 22 December 2021
Unisoc adopts Imagination AI in 5G chips
Unisoc has used Imagination Technologies' Series3NX neural network accelerator (NNA) IP in its new smartphone 5G platforms - Tanggula T770 and T760 system-on-chips (SoC), according...
Wednesday 17 November 2021
Semiconductor market equilibrium unlikely until 2023, says MediaTek CEO
The semiconductor sector will not have a chance to achieve market equilibrium until after new foundry capacities come online in 2023, and until then uneven supply of chips and components...
Monday 8 November 2021
Chicony benefits from restriction on China-made surveillance cameras in US, Europe
As China-based makers of surveillance IP camera modules have faced increasing government restrictions on adoption of their products in the US and Europe due to security concerns,...
Tuesday 2 November 2021
Synopsys and TSMC to develop broad IP portfolio on TSMC N4P process
Synopsys has announced a collaboration with TSMC to develop a broad portfolio of Synopsys DesignWare Interface and Foundation IP on the TSMC N4P process. The collaboration enables...
Wednesday 27 October 2021
TSMC intros N4P process
TSMC has introduced its N4P process, a performance-focused enhancement of the foundry's 5nm technology platform.
Friday 10 September 2021
Foxconn to make SiC components at 6-inch fab for EV, solar apps
Foxconn (Hon Hai) Technology Group has disclosed that at its newly-acquired 6-inch wafer fab in Hsinchu, northern Taiwan, the company will be making SiC components and IR MEMS sensors...
Wednesday 8 September 2021
Vivotek IP cameras adopted for MRT in Bangkok
Smart security surveillance solution provider Vivotek had a total of 570 MD8563-EH mobile dome network cameras adopted for a newly completed mass rapid transit (MRT) system across...
Monday 9 August 2021
Chicony Electronics extends use of IP cameras to driver monitor systems
Keyboard and CCM (compact camera module) maker Chicony Electronics has extended application of video-recording IP cameras from smart home devices to driver monitoring systems, commercial...
Wednesday 30 June 2021
Compound semiconductors now national strategic materials, says GlobalWafers chair
Compound semiconductors will become a key industry sector reaching a national strategic level in importance, as they will be badly needed to power many critical technological applications...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Monday 24 May 2021
Vivotek ramping up IP surveillance camera output
Vivotek, a Taiwan-based provider of security surveillance solutions, will ramp up its output for IP surveillance cameras by 40% in June 2021 when it commences the operations of its...
Monday 24 May 2021
GUC announces GLink-3D die-on-die interface IP using TSMC N5 and N6 process for 3DFabric advanced packaging technology
Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI,...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research