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    Audi talent swap highlights Taiwan supply chain’s cross-sector shifts
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    NEWS TAGGED JCET
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Monday 30 March 2026
    SEMICON China 2026: JCET CEO makes the case for atomic-level packaging to carry Moore's Law forward
    Advanced wafer manufacturing is approaching physical limits near the 1nm node, according to Zheng Li, director and CEO of JCET Group.
    Wednesday 11 March 2026
    JCET opens automotive and robotics chip packaging plant in Shanghai Lingang

    JCET, China's leading semiconductor packaging and testing provider, has launched a facility focused on automotive electronics and robotics...

    Thursday 30 October 2025
    Commentary: China's JCET bets on AI to challenge global packaging giants
    Artificial intelligence (AI) is reshaping the global semiconductor supply chain and accelerating transformation in IC packaging and testing. As Qualcomm moves into the AI data center...
    Thursday 30 October 2025
    JCET unveils Singapore blueprint for next-gen semiconductor packaging
    Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
    Wednesday 3 September 2025
    China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
    Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
    Thursday 26 June 2025
    Chinese chip giants multiplying subsidiaries in race for supply chain control

    Amid rising US-China tech tensions and growing supply chain risks, China's top semiconductor companies are rapidly forming new subsidiaries...

    Monday 19 May 2025
    AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
    China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...
    Monday 21 April 2025
    China's JCET hits all-time high in 2024 revenue, cements global OSAT third position
    JCET Group, China's top OSAT provider, reported record revenue of CNY35.962 billion (US$4.9 billion) for 2024, up 21.24% compared to the previous year. Net income attributable to shareholders...
    Wednesday 5 February 2025
    China fosters another IC unicorn as BYD fund moves in
    As the spring begins for 2025, China's IC industry has seen a major injection of funding. Wuxi SJ Semiconductor has closed a financing agreement worth roughly US$700 million. This...
    Tuesday 7 January 2025
    Chinese firms seek to recruit former Samsung VP amid advanced packaging talent rush
    Samsung Electronics' packaging R&D chief J. C. Lin has recently resigned after a two-year tenure. Following the development, reports have emerged that Chinese semiconductor firms...
    Monday 23 December 2024
    TSMC's wafer manufacturing 2.0 reshapes advanced packaging market
    TSMC introduced "Wafer Manufacturing 2.0" in July 2024, integrating packaging, testing, and photomask production into its portfolio. This move underscores a seismic shift in the advanced...
    Monday 9 December 2024
    The Chinese government backs JCET's expansion into AI chip packaging
    The Chinese semiconductor industry is making strides in building an advanced local supply chain for packaging and testing, despite the US government's export controls targeting advanced...
    Tuesday 3 December 2024
    Chinese state-owned CRC takes control of JCET
    Almost a year after the initial announcement, JCET has completed its stock-holding transfer and appointed a new chairman, solidifying control under a Chinese state-owned conglomerate...
    Thursday 14 November 2024
    Chairman of top Chinese OSAT 'JCET' resigns after state-owned company becomes largest shareholder
    JCET Group, China's top semiconductor packaging and testing firm, announced on November 13, 2024, that chairman Yonggang Gao, along with directors Peng Jin and Chunsheng Zhang, have...
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    Wednesday 7 October 2026
    Chunghwa Telecom's Simplified Modular Data Center delivers fast turnkey deployment