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Friday 1 June 2018
China IC backend output value to exceed US$30 billion in 2018, says Digitimes Research
The output value of China's IC packaging and testing industry will exceed US$30 billion for the first time in 2018, according to Digitimes Research.
Thursday 8 February 2018
China IC backend houses vying for orders for mining ASICs
Major China-based OSAT companies including Jiangsu Changjiang Electronics Technology (JCET), Tongfu Microelectronics and Tianshui Huatian Technology are all gearing up to compete...
Monday 18 September 2017
SJSemi, Qualcomm announce qualification of 10nm ultra-high density wafer bumping technology
China-based SJ Semiconductor has started the qualification of 10nm ultra-high density wafer bumping for Qualcomm, according to the companies. This represents SJSemi's further improvement...
Wednesday 5 July 2017
Sigurd to acquire half of Winstek via Bloomeria takeover
IC testing company Sigurd Microelectronics has announced plans to acquire 100% of Singapore-based Bloomeria Limited, which will allow the Taiwan-based company to also obtain a more...
Wednesday 26 April 2017
SMIC reportedly hires former TSMC R&D exec
Speculation has emerged that Mong-song Liang, formerly a senior director of R&D at Taiwan Semiconductor Manufacturing Company (TSMC) advanced modules technology division, will...
Friday 18 November 2016
ASE-SPIL merger still under review in China and US
A proposed merger between Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) is still being reviewed by anti-trust authorities in China and the US...
Thursday 21 July 2016
STATS ChipPAC performing below expectations, says report
The performance of STATS ChipPAC still has been lower than expected in recent quarters following its acquisition by China-based Jiangsu Changjiang Electronics Technology for US$780...
Monday 30 May 2016
Digitimes Research: Merger brings more competitiveness to ASE, SPIL
Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have agreed to merge through the formation of a parent holding company, which would allow both...
Friday 1 April 2016
China backend houses expand into advanced-process segment
China-based IC packaging and testing houses are vying for more orders, particularly those requiring advanced technologies, from Taiwan-based IC design houses, according to industry...
Thursday 26 November 2015
Commentary: Taiwan IC backend firms facing challenge from fast expanding China competitors
A recent media report indicating that China-based Jiangsu Changjing Electronics Technology (JCET) has landed SiP (system-in-package) module orders from Apple could serve as a warning...
Wednesday 25 November 2015
China firm reportedly lands SiP device orders from Apple
Jiangsu Changjiang Electronics Technology (JCET), China's largest semiconductor packaging and test services provider, has reportedly grabbed assembly orders for SiP (system-in-package)...
Wednesday 29 July 2015
China IC backend firms reportedly obtain orders from Qualcomm, MediaTek
Major China-based IC backend houses including Jiangsu Changjiang Electronics Technology and Nantong Fujitsu Microelectronics have obtained orders from Qualcomm and MediaTek, which...