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Wednesday 1 July 2009
ASE secures NT$12 billion syndicated loan
Advanced Semiconductor Engineering (ASE) has recently signed a NT$12 billion (US$366.34 million) five-year syndicated loan agreement with 17 banks. The loan will be used to repay...
Wednesday 17 June 2009
Wah Hong lands NT$570 million syndicated loan
Taiwan-based LCD optical film maker Wah Hong Industrial signed for a 3-year syndicated loan for NT$570 million (US$17.5 million) on June 16 to improve its mid-term financial structure,...
Tuesday 16 June 2009
PSC to gain loan repayment extension by collateralizing Rexchip shares
Powerchip Semiconductor Corporation (PSC) has reportedly agreed to collateralize its stake in Rexchip Electronics, in order to postpone repayments on a NT$75.5 billion (US$2.29 billion)...
Wednesday 27 May 2009
Micron pays back loan borrowed from Inotera
Inotera Memories, on May 26, said it has collected US$85 million from Micron Technology in repayment for a six-month loan to facilitate its acquisition of Qimonda's stake in Inoter...
Thursday 21 May 2009
Solar cell maker E-Ton requests banks to ease conditions for loan repayment
E-Ton Solar Tech, a Taiwan-based solar cell maker, has announced that it is negotiating with bank creditors for a revision to the terms of a syndicated loan to reduce its financial...
Monday 27 April 2009
ProMOS gets final nod for NT$3 billion syndicated bank loan
ProMOS Technologies has announced that a syndicate of banks has finalized an NT$3 billion (US$89 million) loan, which will enable it to buy back its convertible bonds.
Tuesday 21 April 2009
ProMOS still waiting for bank approval for syndicated loan
ProMOS Technologies has yet to finalize a syndicated bank loan for NT$3 billion (US$90 million) that it needs to redeem convertible bonds.
Wednesday 8 April 2009
DRAM maker PSC loan repayment extension approved
Powerchip Semiconductor Corporation (PSC) has announced via a company filing with the Taiwan Stock Exchange (TSE) that it has been granted an extension on repayments of existing bank...
Tuesday 24 March 2009
ProMOS still facing loan uncertainty
DRAM chipmaker ProMOS Technologies has seen more than 79% of its ECB bondholders accept its tender offer, meeting the minimum ratio set by its syndicate banks in order to gain a loan...
Monday 23 March 2009
ProMOS says more than 79% of bondholders accepting buyback offer
Taiwan's ProMOS Technologies has announced that as of March 23, 2009, more than 79% of bondholders (number excluding the 12% held by its syndicate banks) have indicated their intention...
Wednesday 4 March 2009
CPT denies seeking government bailout
TFT-LCD panel maker Chunghwa Picture Tubes (CPT) has denied that it has asked for Taiwan government bailout, saying the CPT group's cash of more than NT$20 billion (US$569.96 million)...
Friday 27 February 2009
DRAM maker ProMOS reaffirms ECB redemption
ProMOS Technologies has released a statement to further clarify its loan extension announcement made recently (February 25). The cash-strapped DRAM chipmaker reiterated that over...
Thursday 26 February 2009
ProMOS allowed to extend bank loan repayments for one year
Taiwan's DRAM chipmaker ProMOS Technologies has revealed that it has been allowed to extend repayments on existing bank loans for one year under a government assistance program.
Friday 20 February 2009
ProMOS offers to buy back bonds, but says it has not enough money
ProMOS Technologies has announced an offer to buy back US$335 million worth of convertible bonds (CBs), but maintained that it will only have less than NT$3 billion (US$8.66 million)...
Thursday 19 February 2009
DRAM maker PSC allowed to extend loan repayments for six months, says paper
Powerchip Semiconductor Corporation (PSC), one of Taiwan's financially-distressed DRAM chipmakers, has been given an additional six months to complete repayments on its NT$60 billion...
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