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Tuesday 2 June 2026
Samsung signals broader AI memory deployment with HBM5 roadmap and thermal tech
Samsung Electronics has used Computex 2026 to outline a broader AI memory strategy, highlighting HBM5, thermal management, and advanced packaging as it prepares for next-generation...
Tuesday 2 June 2026
Edimax Group to Showcase AI Edge Innovation at Expo 2026

Edimax Group will host Expo 2026 during Computex 2026, bringing together its group companies, including EDIMAX Technology Co., Ltd. (TWSE: 3047, including its Edimax...

Tuesday 2 June 2026
HPE pulls forward long-term targets as AI infrastructure demand surges
Hewlett Packard Enterprise (HPE) reported a record second fiscal quarter of 2026, with management saying accelerating demand for AI infrastructure, networking, and enterprise modernization...
Monday 1 June 2026
Zhen Ding sees AI reshaping PCB's role as demand accelerates
PCB maker Zhen Ding said AI is driving a structural shift in electronics, redefining the role of printed circuit boards from passive signal connections to critical platforms for high-performance...
Monday 1 June 2026
Advantech approves dividends, board election as it expands edge AI strategy
Advantech approved its 2025 financial statements and a new board at its annual shareholders' meeting in Taipei, while outlining a broader push into edge AI platforms. The industrial...
Monday 1 June 2026
Asus ready to compete as Apple expands into budget laptop market
Asustek Computer (Asus) chairman Jonney Shih outlined the company's artificial intelligence (AI) strategy roadmap and also commented on whether Apple's entry-level MacBook Neo could...
Monday 1 June 2026
Interview: Sharp CEO taps Foxconn ecosystem for brand revival
Sharp President and CEO Tetsuji Kawamura said the company has eased some long-standing management pressures, but its main challenge now is to expand its brand, develop new businesses,...
Sunday 31 May 2026
Aspeed and Lattice announce partnership on programmable server management chip
Aspeed Technology and Lattice Semiconductor have formed a strategic partnership that could reshape how servers are managed in data centers worldwide. The collaboration aims to combine...
Saturday 30 May 2026
Merry Electronics begins governance overhaul, names new chairman
Merry Electronics completed a board reshuffle after its 2026 annual general meeting on May 26, with the board electing Keng-Pin Liao as the new chairman effective immediately. Former...
Friday 29 May 2026
Compal accelerates server push with Texas plant and aims for 40% non-PC revenue
Compal Electronics said it was scaling up its server business and expects server revenue to reach 8-10% of total sales in 2026 as AI server rack-scale systems ramp and a new Texas...
Friday 29 May 2026
India's C2i Semiconductors tapes out AI power chip as investors back scaling of data center power technology
C2i Semiconductors has advanced its power management technology with the tape-out of a chip designed for AI infrastructure, while also securing fresh venture backing to expand development...
Thursday 28 May 2026
Salesforce Taiwan targets double-digit growth on AI applications and services
Since opening its Taipei office in January 2026, customer relationship management (CRM) technology firm Salesforce has continued to expand its Taiwan-based team, shifting from remote...
Thursday 28 May 2026
Shiny Chemical sees AI and advanced semiconductor processes drive IPA and PM capacity expansion
Shiny Chemical Industrial said demand for its electronic-grade products is being driven mainly by advanced semiconductor processes, AI, and high-performance computing, with its share...
Wednesday 27 May 2026
Sino-American Silicon taps AI to tackle Taiwan's green power crunch
Sino-American Silicon Products (SAS) is turning to AI-based power management as Taiwan's green-power shortage persists, and electricity demand from advanced chipmaking and AI data...
Wednesday 27 May 2026
Humanoid robot mass production hits a thermal wall
As humanoid robots move closer to mass production, thermal management is emerging as a critical bottleneck. Component efficiency, cramped joint architectures, and limited heat-dissipation...