Rayzher Industrial, a high-tech factory gas supply system solutions provider, reported consolidated revenue of NT$369 million (approx. US$11.7 million) in August 2026, up 83.26% year-over-year...
MicroIP said on Sept. 10 that it secured a systems integration contract worth about NT$630 million for a major AI smart residential project in northern Taiwan. The agreement is expected...
Ability Enterprise reported August 2026 revenue of NT$1.313 billion, its highest monthly level since December 2015, as three new product lines entered volume shipments. The Taiwanese...
Foxtron has obtained ISO/SAE 21434 certification for road-vehicle cybersecurity engineering and ISO 24089 certification for road-vehicle software-update engineering following an assessment...
Capacity for advanced semiconductor processes and packaging remains tight, while mature-node chips required for AI-related peripheral applications are also facing mounting supply pressure...
Chinese GPU developer Biren Technology has teamed up with Shanghai University to establish an Integrated Circuit Intelligent Chip Joint Laboratory, expanding their cooperation into...
JM-Applied, a Taiwanese semiconductor gas equipment manufacturer and supply chain member for Micron and TSMC, said on September 4 that revenue in the first half of 2026 exceeded NT$600...
As AI data centers scale rapidly, Eaton is expanding beyond traditional power management into modular power deployment, next-generation DC conversion and liquid cooling, positioning...
Taiwan Mobile announced that it is participating for the first time with Systex in the "2026 Build for NextGen – International Sustainable Intelligent Building & Intelligent...
South Korean OSAT player LB Semicon has begun shipments to Qualcomm Inc., marking a key step in its effort to move beyond a business structure long centered on display driver ICs (DDI)...
As AI, high-performance computing (HPC), and advanced packaging continue to move toward higher levels of power integration, chip power consumption is rising rapidly....
Apple has made another major management shake-up. After Tim Cook stepped down as CEO and was succeeded by John Ternus, formerly head of hardware engineering, veteran Phil Schiller...
As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...
Samsung Electronics is using a cross-division "One Team" model to develop its sixth-generation high-bandwidth memory, HBM4, but the approach is creating a new challenge for the newly...
LG Display (LGD) has introduced a new "PFAS-free" component verification process for suppliers as it prepares for expected European Union (EU) restrictions on PFAS, aiming to eliminate...
