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    Kaynes' Japan push signals India's bid to become an alternative chip packaging hub
    2min ago
    InnoScience wins GaN patent battle against Infineon in China
    13min ago
    Nvidia’s hold on AI inference chips strengthened as in-house rivals failed to bite
    Jun 16, 19:04
    NEWS TAGGED MOU
    Tuesday 16 June 2026
    Rapidus signs UK chip pact in push for 2nm customers

    Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025...

    Saturday 30 May 2026
    Intel makes first major move into India's semiconductor ecosystem with advanced glass substrate manufacturing MoU
    India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state...
    Tuesday 7 April 2026
    Taiwan, Japan join forces on next-gen drones with core technology alliance
    The "brain" of a drone plays a critical role in flight missions. While Taiwanese manufacturers have advantages in drone hardware production, integrating the core control systems remains...
    Monday 30 March 2026
    Toshiba, Rohm, Mitsubishi Electric, and partners begin talks on integrating Japanese power device and semiconductor businesses
    Toshiba, Rohm, Mitsubishi Electric, and partners begin talks on integrating Japanese power device and semiconductor businesses
    Tuesday 3 March 2026
    Nasdaq-listed AI chipmaker Blaize bets on India for sovereign edge inference growth
    As much of the global semiconductor industry remains fixated on AI training accelerators and hyperscale GPUs, US-based AI processor company Blaize is making a different wager in India:...
    Tuesday 24 February 2026
    QuiX Quantum and Artilux Partner on Energy-Efficient Photonic Quantum Computing

    QuiX Quantum, a leading provider of photonic quantum computing hardware, and Artilux, a developer of advanced semiconductor-based photonic detector technologies, today...

    Wednesday 11 February 2026
    Nokia opens its largest fixed network R&D facility in Tamil Nadu
    Nokia has inaugurated a new research and development (R&D) facility for fixed networks in Tamil Nadu, marking the Finnish telecom equipment maker's largest such center globally...
    Friday 23 January 2026
    SEALSQ, Gujarat govt, and Kaynes SemiCon sign MoU to establish India's first secure post-quantum semiconductor center
    SEALSQ Corp, a developer of semiconductors and post-quantum technology solutions, announced on January 21, 2026, that it has signed a non-binding Memorandum of Understanding (MoU)...
    Tuesday 9 December 2025
    South Korea signs MoU with Arm Holdings to establish 'Arm School' for IC design education
    The South Korean government has signed a memorandum of understanding (MoU) with Arm Holdings, the UK-based silicon IP provider, to establish an educational institution tentatively...
    Tuesday 9 December 2025
    Tata Group and Intel form strategic alliance to assemble chips in India
    Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
    Wednesday 3 December 2025
    Onsemi and Innoscience sign MoU to explore expanded GaN power device production
    Onsemi and Innoscience have signed a memorandum of understanding to assess opportunities for expanding the manufacturing of gallium nitride (GaN) power devices, with a focus on accelerating...
    Monday 17 November 2025
    Tata Electronics partners with NIELIT Kohima to develop semiconductor skilling programs in Northeast India
    Tata Electronics has signed a Memorandum of Understanding with the Kohima unit of the National Institute of Electronics and Information Technology (NIELIT) to collaborate on semiconductor-related...
    Tuesday 28 October 2025
    Foxconn-backed Smart Mobility showcases homegrown EV charging management system at Riyadh Auto Show
    Smart Mobility, a joint venture between Foxconn's Foxconn Interconnect Technology (FIT) and Saudi Arabia's Saleh Suleiman Alrajhi & Sons, recently unveiled its self-developed Charging...
    Tuesday 14 October 2025
    Lynas and Noveon sign MOU to develop US rare earth magnet supply chain
    Australian rare earth producer Lynas Rare Earths has entered a non-binding memorandum of understanding with US rare earth magnet manufacturer Noveon Magnetics to jointly establish...
    Tuesday 30 September 2025
    Innodisk subsidiary Aetina and South Korea's Mobilint sign MOU to accelerate edge AI commercialization
    Aetina Corporation, a subsidiary of Innodisk, has signed a memorandum of understanding (MOU) with South Korean AI semiconductor company Mobilint, entering a strategic partnership that...
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    TI
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    Retronix Launches Sparrow Hawk Edge AI Computing Platform Worldwide
    CPC
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook