Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players.
The passive component giant Yageo held its shareholders' meeting on May 30. Founder and chairman Pierre Chen stated that current inventory adjustments have reached a healthy level...
Merger and acquisition (M&A) transactions in Taiwan grew 12% year-on-year in 2023 to 131 cases and may continue hitting another new high in 2024. Simon Huang, chairman of WPG...
Photomask company Taiwan Mask Corporation (TMC) has acquired four seats on optical component manufacturer TrueLight's board, during the latter company's board of directors election...
Charles Shen, Chairperson of Zhen Ding, the major PCB company, stated that the first half of 2024, as in previous years, is the off-season for operations. However, compared to the...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Microcontroller manufacturer Nuvoton Technology held its shareholders' meeting on May 28. The company reported that the PC market performed better than initially expected, and MCU...
The semiconductor industry is the lifeblood of South Korea, a country that heavily depends on its exports. In 2023, South Korea exported US$131 billion of semiconductors and imported...
With 2024 widely regarded as the inaugural year for the AI PC era, Taiwanese PCB manufacturers are revving up to meet the upcoming replacement demand for AI PCs and notebooks, expected...
Sensor component specialist Taiwan-Asia Semiconductor (TASC) will boost its GaN and SiC component shipments in the second half of 2024, to generate more than 5% of revenue from the...
As AI technology increasingly moves from the cloud to edge devices, the use of passive components—in particular Multilayer Ceramic Capacitors (MLCC)—will rise exponentially...
