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NEWS TAGGED PASSIVE, PCB, OTHER IC COMPONENTS
Monday 20 May 2024
Japanese initiative helps semiconductor material startups cross Death Valley
The Japanese government has introduced a Strategic Startup Promotion Plan (SIP) to address the challenges facing material and pharmaceutical startups.
Friday 17 May 2024
Generative AI is transforming the game 'from cloud to edge'
The internet giants are building comprehensive ecosystems, in which Generative AI (GenAI) plays a pivotal role. "From cloud to the edge" will be an inevitable trend.
Friday 17 May 2024
ASML's secret sauce for semiconductor success amid challenges in the Angstrom Era
Moore's Law is not advancing as fast as it used to be under 2nm and even into the Angstrom level, and competitors are trying to catch up. Can ASML, the Dutch semiconductor equipment...
Friday 17 May 2024
Inventories likely fall soon in global semiconductor industry
Recent data indicates an uptick in semiconductor industry inventories, particularly among top chip companies capitalizing on the AI trend. While China has witnessed a rise in listed...
Thursday 16 May 2024
FCCL firm Taiflex opens new plant in Thailand
Taiflex Scientific, a specialist in flexible PCB materials such as flexible copper clad laminates (FCCL), celebrated the grand opening of its Thailand plant on May 15 at the Amata...
Thursday 16 May 2024
Semiconductor firms' ranking as 'most-desired employers' rising fast in Japan
Several media reports that young American engineers complained about working at TSMC. How about Japanese engineers? Would they be holding grudges too?
Thursday 16 May 2024
Taiwan PCB makers focus spending on high-end HDI boards
Taiwan-based PCB manufacturers are prioritizing capital expenditure on high-end HDI boards.
Wednesday 15 May 2024
AT&S to sell medtech PCB factory in South Korea
Advanced Technologies & Solutions (AT&S), an Austria-based PCB and IC substrate manufacturer, has announced plans to sell its plant in Ansan, South Korea, which largely services...
Wednesday 15 May 2024
PCB industry moves up the ladder as silicon photonics packaging demand grows
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...