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    Shanghai HiSilicon expands DDI push across all display sizes
    10h 34min ago
    Applied Materials CEO outlines a trio of innovation priorities for AI chip race
    10h 35min ago
    China’s domestic AI chips target 3D packaging, optical interconnects and software ecosystems
    10h 35min ago
    AI accelerator growth shifts toward value, not volume
    10h 35min ago
    Analysis: China’s EV exports shift from volume to value as rebates shrink
    10h 35min ago
    NEWS TAGGED PROCESSOR
    Tuesday 13 October 2026
    SK Hynix unveils low-power processor design for SSDs
    SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
    Tuesday 13 October 2026
    China's Blue Core Computing secures nearly US$300 million to challenge x86, Arm in AI servers
    Shenzhen-based Blue Core Computing (Shenzhen) Technology has raised nearly CNY2 billion (≈ US$298.7 million) in Series B financing to accelerate production of its RISC-V server...
    Thursday 8 October 2026
    Samsung to exit in-house automotive AP, focus on high-margin chips
    Samsung Electronics' System LSI division is reportedly planning a retreat from the automotive application processor (AP) business and launching a major restructuring, with a future...
    Tuesday 6 October 2026
    Samsung ramps Exynos 2700 wafer production as second-gen 2nm rollout advances
    Samsung Electronics has reportedly begun front-end wafer mass production of its next-generation Exynos 2700 mobile application processor, with production volume planned at more than...
    Thursday 1 October 2026
    Qualcomm, Samsung redesign chip packaging as heat limits phone performance
    Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
    Wednesday 30 September 2026
    Apple A20 Pro ditches PoP memory packaging for WMCM
    Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
    Wednesday 23 September 2026
    Hygon takes China's CPU ambitions beyond servers, into physical AI

    China's Hygon Information Technology is extending its processor ambitions beyond servers and data centers with the launch of its first...

    Tuesday 22 September 2026
    SiPearl delivers first homegrown server chips for Europe's exascale supercomputer
    SiPearl, a fabless company backed by the European Union and France, has delivered the first Rhea1 CPU samples to Bull for integration into Europe's JUPITER supercomputer, moving the...
    Tuesday 22 September 2026
    Alibaba speeds V900 rollout, targeting 20GW of data centers
    Alibaba Group is accelerating the rollout of its next-generation Zhenwu V900 accelerator by about six months as it expands a vertically integrated computing platform spanning processors,...
    Tuesday 22 September 2026
    MediaTek unveils Dimensity CX C10 Max for premium Googlebook devices

    MediaTek has introduced a new chip aimed at premium, ultra-portable Googlebook devices, underscoring how next-generation AI, battery...

    Thursday 17 September 2026
    Samsung reportedly starts Tesla chip trial production at Taylor fab

    Samsung Electronics has reportedly begun trial production of Tesla's next-generation AI5 processor at its Taylor foundry in Texas, moving...

    Tuesday 15 September 2026
    MediaTek unveils first 2nm chip to run 30 billion AI models on phones arriving this quarter

    MediaTek has become the first merchant silicon vendor to announce a 2-nanometer smartphone processor, unveiling the Dimensity 9600 Pro...

    Tuesday 15 September 2026
    XPeng's Turing chip expands beyond cars
    XPeng Motors is extending its self-developed Turing AI chip from intelligent electric vehicles (EVs) into humanoid robots, broadening the processor's role in the company's Physical...
    Friday 11 September 2026
    Samsung's Exynos gains ground as Galaxy S26 lifts share to 9%

    Samsung Electronics is regaining ground in the global smartphone processor market, with its Exynos share rising to 9% in the second...

    Monday 7 September 2026
    Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law
    Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...
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    BIZ FOCUS
    Oct 13, 16:08
    Chenbro unveils AI rack-level solutions at 2026 OCP Summit
    Thursday 8 October 2026
    Dietary Therapy in Traditional Chinese Medicine and Modern Nutritional Science
    Thursday 8 October 2026
    Edge-Cloud Computing Blocks Scams Before the Click
    Thursday 8 October 2026
    Nuvoton, AMI Empower AI Factories Via Arbel NPCM8XX OpenBMC