Imec and Globalfoundries (GF) have jointly announced a hardware demonstration of a new artificial intelligence chip. Based on Imec's analog in memory computing (AiMC) architecture...
As demand for locally-developed CPUs and GPUs in China continues rising amid the US trade sanctions against Chinese IT enterprises, Taiwan-based IC substrate suppliers are expected...
Chinese handset vendor Xiaomi reportedly will work more closely with MediaTek to jointly develop customized SoCs for 5G smartphones after having its Redmi 10X series adopt the chipmaker's...
Backend houses are gearing up for shipments for Microsoft's upcoming Xbox Series game consoles slated to debut at the end of July, and expect shipments for the new consoles to peak...
Intel has launched its first heterogeneous chip architecture made using its Foveros 3D chip stacking technology, while TSMC is looking to commercialize its SoIC (system on integrated...
Backend IC packaging and testing service providers will begin shipments of the customized SoCs designed by AMD specifically for PlayStation 5 (PS5) to their downstream partners in...
Dialog Semiconductor has announced a new Wireless Ranging (WiRa) software development kit (SDK) that it says adds highly accurate and reliable distance measurement capabilities to...
Pingtouge, Alibaba's semiconductor subsidiary, has stepped up its AI and server related chip development while extending its ties with TSMC and Global Unichip, and has the potential...
Shipments of smartphone-use application processors (AP) in the China market are expected to experience a steep drop of 37.8% on year in the second quarter of 2020, as China's handset...
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing experience and doubled the storage across all standard configurations.
Speculation is circulating that Samsung Electronics' 5nm EUV process has attracted orders from Nvidia for its next-generation graphics processor series, but sources familiar with...
