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Friday 9 April 2021
AiP substrates in growing demand for new mmWave iPhones in 2021
IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Wednesday 24 February 2021
High-capacitance MLCC prices set to rise
MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...
Monday 22 February 2021
Chipmakers placing extra orders for BT substrates amid tight supply
As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...
Friday 19 February 2021
Tape COF substrate demand picking up
Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Wednesday 25 November 2020
Taiwan IC substrate suppliers gearing up for mmWave AiP modules
Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages)...
Friday 20 November 2020
Concerns rising over tight BT substrate supply for handset SoCs
Handset application processor vendors have expressed concerns about the supply of BT substrates that may fall due to the suspension of production at Unimicron Technology's fire-hit...
Thursday 19 November 2020
Semco reportedly to exit rigid-flex PCB segment
Samsung Electro-Mechanics (Semco) reportedly will phase out its rigid-flex PCB (RFPCB) business in 2021 amid unfavorable factors on both the supply and demand sides, according to...
Thursday 27 August 2020
Taiwan makers poised to scale up AiP substrate shipments in 2021
Taiwan-based IC substrate makers Unimicron, Nan Ya PCB and Kinsus Interconnect are expected to significantly scale up their AiP (antenna-in-package) substrate shipments in 2021, driven...
Tuesday 18 August 2020
Daeduck to expand ABF substrate capacity for Samsung demand
Korea-based PCB maker Daeduck Electronics, a supplier of Samsung Electronics, will invest KRW90 billion (US$76 million) to expand ABF substrate capacity, according to industry sour...
Friday 24 July 2020
ABF substrate suppliers see clear order visibility through 2021
ABF substrate suppliers including Unimicron Technology, Nan Ya PCB and Kinsus Interconnect Technology have all seen their order visibility extend into 2021, thanks to continued robust...
Wednesday 22 July 2020
Nittobo plant fire may disrupt global ABF substrate supply
A recent fire that broke out at one of Nittobo's plants in Fukushima, Japan is expected to impact the already-tight supply of ABF substrates worldwide and push up quotes for them,...
Wednesday 15 July 2020
Taiwan IC substrate makers land more MediaTek orders for 5G chips
Taiwan-based IC substrate makers including Unimicron Technology and Kinsus Interconnect Technology have seen a ramp-up in BT substrate orders for MediaTek's 5G SoCs as the chipmaker...
Wednesday 1 July 2020
Taiwan makers revving up to boost FC-AiP substrate yield rates
Taiwan-based IC substrate makers continue to improve their AiP (antenna in package) substrate production yield rates seeking to gain a firm presence in AiP packaging that is expected...
Tuesday 30 June 2020
5G iPhone shipments may be much weaker than expected in 2020, say sources
Shipments of mmWave-enabled 5G iPhones slated for launch later this year are estimated to reach only 15-20 million units in 2020 compared to a previous supply chain estimate of 30-40...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research