Samsung Electro-Mechanics (Semco) reportedly will set up a new ABF substrate plant in Vietnam mainly to provide dedicated capacity for Intel, with construction slated to kick off...
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
Samsung Electro-Mechanics (SEMCO) reportedly plans to install a new production line for ABF-based flip chip ball grid array (FCBGA) substrates at its factory site in Vietnam, with...
Suppliers of antenna-in-package (AiP) substrates for Apple's new iPhones are gearing up for a ramp-up in demand for mmWave models, according to industry sources.
Apple reportedly has enlisted AT&S as a new supplier of BT-based AiP (antenna in package) substrates for new 5G mmWave iPhones to be released later in the year, expanding to five...
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
BT substrate vendors in the supply chain of Apple devices are all gearing up shipments for next-generation Apple Watch, AirPods and iPhone devices, which will all massively adopt...
The global supply of IC substrates will not see major inprovement until late 2021 or 2022 when Taiwan-based suppliers' additional capacity comes online, according to industry sourc...
Taiwan-based Nichidenbo, which distributes capacitors, MLCCs and other passive components for vendors such as Nippon Chemi-Con and Samsung Electro-Mechanics (Semco), has expressed...
IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
MLCC vendors including Samsung Electro-Mechanics (Semco) and TDK are likely to raise their quotes for high-capacitance MLCCs in response to stronger-than-expected demand for 5G handset...
As supply of high-end BT substrates has turned tight in the first quarter of 2021, major chipmakers including Qualcomm and MediaTek are moving aggressively to secure more capacity...
Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Taiwan-based IC substrate suppliers including Kinsus Interconnect and Unimicron Technology are expected to gain growth momentum from increasing demand for AiP (antenna in packages)...
