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NEWS TAGGED WAE
Wednesday 17 March 2010
Walton to add capacity, employees in 2010 to satisfy DDR3 testing demand
Walton Advanced Engineering (WAE) is mulling plans to expand its existing facility and revise upward its capex for 2010, having seen strong orders mainly for DDR3 memory testing,...
Wednesday 3 March 2010
Memory backend houses seeing strong demand for DDR3 chips
Powertech Technology (PTI), Walton Advanced Engineering (WAE) and Thailin Semiconductor are all expected to see a strong March, as the memory backend service providers have landed...
Wednesday 3 February 2010
Walton expanding equipment; may lift 2010 capex on increased DDR3 testing demand
Walton Advanced Engineering (WAE) has been speeding up adding testing equipment, and may raise its capex for 2010 as it is running at almost full capacity, according to the memory...
Friday 29 January 2010
Memory backend firm Walton sees influx of DDR3 orders
Walton Advanced Engineering will continue to operate during most of the Lunar New Year holidays, due to an influx of orders for DDR3 chips, according to the company.
Wednesday 27 January 2010
Walton to benefit from Winbond orders for GDDR chips, says paper
Backend service supplier Walton Advanced Engineering is expected to benefit from major contracts from Elpida Memory and Winbond Electronics starting in the second quarter of 2010...
Wednesday 6 January 2010
Memory backend firm Walton 4Q09 revenues up 7% on quarter
Walton Advanced Engineering has announced revenues for the fourth quarter of 2009 increased 6.82% sequentially to NT$1.596 billion (US$50.15 million). The memory packaging and testing...
Thursday 24 December 2009
ChipMOS loses DRAM packaging patent lawsuit against Walton
Memory packaging and testing house Walton Advanced Engineering has prevailed in a lawsuit in Taiwan brought by rival ChipMOS Technologies pertaining to packaging technology used for...
Tuesday 22 December 2009
Memory IC backend firm UTAC expects strong 4Q09, flat 1Q10
United Test and Assembly Center (UTAC) Taiwan has said revenues for the fourth quarter of 2009 are set to hit the year's high, and expects to see levels in the upcoming first quarter...
Monday 14 December 2009
UTAC to raise DRAM backend quotes, but PTI not to follow suit
In response to speculation that quotes for DRAM packaging and testing are likely to rise to reflect tight capacity and rising material costs, United Test and Assembly Center (UTAC)...
Monday 16 November 2009
Memory backend suppliers gearing up for DDR3
With customers pushing the DDR3 generation, memory packaging and testing firms Powertech Technology (PTI), Formosa Advanced Technologies Company (FATC) and Walton Advanced Engineering...
Friday 13 November 2009
Memory IC backend firm Walton positive about 4Q09
Walton Advanced Engineering has revised its fourth-quarter revenue guidance to sequential growth, compared to flat revenues that it initially estimated. The memory IC packaging and...
Monday 21 September 2009
Memory backend firms enjoy rising DDR3 shipments
Taiwan-based memory packaging and testing houses Powertech Technology (PTI) and Walton Advanced Engineering have landed growing orders for DDR3 memory, according to market watchers...
Monday 21 September 2009
Memory backend supplier Walton says DRAM demand picking up
Walton Advanced Engineering, a Taiwan-based memory packaging and testing house, expects monthly revenues to grow sequentially through November, according to the company. The backend...
Wednesday 4 February 2009
Taiwan packaging houses not affected by Qimonda insolvency
United Test and Assembly Center (UTAC) Taiwan and Walton Advanced Engineering have said that Qimonda's filing for bankruptcy protection will not impact the companies, as both memory...
Monday 1 September 2008
Power ASE leads in 1H08 profitability
Despite a listless memory industry status in 2008, Power ASE Technology managed to maintain its gross margin above 40% in the first half of 2008 thanks to aggressive expansion of...
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