Demand for anylayer HDI boards from Chinese handset vendors has been increasing sharply as such boards are badly needed for carrying 7nm APs, now mainstream core SoCs for their smartphones,...

Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...

Apple is expected to enter the 5G race in the third quarter of 2020, leapfrogging to the top in 5G smartphones market, according to Strategy Analytics.

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, will be ramping up its capex next year to better meet growing demand for packaging high-speed fiber-optic...

Supply of HDI (high-density interconnect) boards has fallen short of demand in the second half of 2019, with Taiwan makers having to reschedule shipments to fulfill mounting orders...

Foxconn Electronics has announced that it will invest NT$10 billion (US$327.23 million) for new shares to be issued by Asia Pacific Telecom (APT) through private placement for development...

The number of 5G service subscribers in South Korea is expected to reach over five million by the end of 2019, a significant growth from four million at the end of July, according...

Foxconn Technology Group will step up transforming into a provider of technology services by deepening deployments in electric vehicle, smart heath care and robot industries while...

Asustek Computer expects to post flat growth or an up to 5% sequential decrease in PC sales in the fourth quarter, while sales of its component products including motherboards and...

ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, has reported net profit shot up 115.7% sequentially to a 13-quarter high of NT$268 million (US$8.78 million)...

TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...

Samsung Electronics has managed to become a leading provider of 5G network equipment, with its global market share reaching nearly 28% in the first half of 2019, according to Daijun...

Third-quarter-2019 smartphone AP shipments to China-based vendors came to 210 million units, down 1.8% on quarter and 9.4% on year.

TSMC and UMC are set to allocate more of their available 12-inch fab capacities for the fabrication of display driver ICs in 2020 to satisfy growing demand for applications such as...

Cooling fan maker Power Logic has seen orders for graphics cards pick up substantially in the second half of 2019, and expects the order pull-in momentum to carry on through 2020.