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IN THE NEWS
Thursday 14 November 2019
Backend specialist ShunSin sees 3Q19 profits hit 13-quarter high
ShunSin Technology, Foxconn Technology Group's IC backend service affiliate, has reported net profit shot up 115.7% sequentially to a 13-quarter high of NT$268 million (US$8.78 million)...
Thursday 14 November 2019
TSMC to build advanced packaging fab in northern Taiwan in 2020
TSMC's planned advanced packaging plant in Miaoli, Northern Taiwan has passed environmental impact assessment, enabling the foundry house to kick off construction of the new fab in...
Thursday 14 November 2019
Samsung growing 5G network equipment biz
Samsung Electronics has managed to become a leading provider of 5G network equipment, with its global market share reaching nearly 28% in the first half of 2019, according to Daijun...
Thursday 14 November 2019
China smartphone AP shipments – 3Q 2019
Third-quarter-2019 smartphone AP shipments to China-based vendors came to 210 million units, down 1.8% on quarter and 9.4% on year.
Thursday 14 November 2019
TSMC, UMC to allocate more 12-inch fab capacity for display driver IC
TSMC and UMC are set to allocate more of their available 12-inch fab capacities for the fabrication of display driver ICs in 2020 to satisfy growing demand for applications such as...
Wednesday 13 November 2019
Power Logic seeing demand for graphics cards pick up
Cooling fan maker Power Logic has seen orders for graphics cards pick up substantially in the second half of 2019, and expects the order pull-in momentum to carry on through 2020.
Wednesday 13 November 2019
Nan Ya set to expand ABF substrate capacity in 2020
Nan Ya PCB has disclosed plans to invest an additional US$48 million in its factory in Kunshan, China, where the Taiwan-based company will expand ABF substrate production capacity...
Wednesday 13 November 2019
Wi-Fi 6 to share spotlight with 5G
A recent Wi-Fi Alliance (WFA) announcement saying that it has granted an Wi-Fi Certified 6 verification for Samsung Electronics' Galaxy Note 10 heralds the arrival of a high-speed...
Wednesday 13 November 2019
TSMC board approves US$6.6 billion for advanced process capacity
The board of Taiwan Semiconductor Manufacturing Company (TSMC) has approved capital appropriations of about US$6.62 billion for the construction of new fab facilities, installation...
Tuesday 12 November 2019
Global Unichip, Alchip set to enjoy over 20% revenue growth in 4Q19
IC design service providers Global Unichip and Alchip are both expected to report over 20% sequential increases in fourth-quarter revenues, thanks to robust orders for developing...
Tuesday 12 November 2019
HDI PCB makers to expand output in 2021
High-density interconnection (HDI) PCB specialists including Compeq Manufacturing and Tripod Technology are both scheduled to have their new production capacities come online in 2021...
Monday 11 November 2019
WinWay IC sockets well adopted by first-tier chipmakers in US, China
Taiwan-based IC testing interface supplier WinWay Technology has entered the supply chains of major chipmakers in the US and China with high-end customized IC sockets and will venture...
Monday 11 November 2019
Niche III-V semiconductors suppliers see bright prospect for 2020
Taiwan's niche-type compound semiconductors makers including Intelligent Epitaxy Technology (IntelliEPI), Transcom and Global Communication Semiconductors are poised to embrace significant...
Friday 8 November 2019
Pegatron enjoys strong profits in 3Q19
Pegatron has reported third-quarter consolidated revenues picked up 18.5% sequentially and 10.2% on year to come to NT$354.8 billion (US$11.58 billion), while the gross margin was...
Friday 8 November 2019
Pegatron mulling more production in Southeast Asia
Pegatron will not rule out setting up new factory sites in Vietnam and India to satisfy customer demand, according to company president and CEO SJ Liao.