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Thursday 28 November 2024
Mixed adoption of non-automotive-grade chips highlights challenges in evolving automotive semiconductor landscape
The automotive industry is experiencing a significant transformation with the rise of electrification and connectivity. Despite this shift, the ecosystem is still in the process of...
Thursday 28 November 2024
SK Hynix's NAND production reportedly accelerates, increasing competitive pressure on Samsung
SK Hynix has reportedly begun mass production of its 321-layer 1Tb TLC 3D NAND Flash products, posing a potential threat to Samsung Electronics' (Samsung) leading position. This development...
Thursday 28 November 2024
LG Group revamps leadership to drive stability and innovation
LG Group convened a board meeting to finalize senior leadership changes across its subsidiaries. While overall promotions were scaled back, the company emphasized advancing R&D...
Thursday 28 November 2024
LG makes major division overhauls, shifting from products to solutions
LG Electronics has announced a major organizational restructuring aimed at shifting from a product-focused strategy to a solution-driven approach. This strategic realignment seeks...
Thursday 28 November 2024
TSMC donates more 12-inch fab equipment to Taiwan govt
Following a previous donation of two sets of 12-inch wafer equipment to Taiwan's National Science and Technology Council (NSTC), TSMC has donated an additional three sets to the Ministry...
Thursday 28 November 2024
Taiwan EMS firms urged to build factories in US
US President-elect Donald Trump advocated for higher tariffs on Canada, Mexico, and China before assuming office. Establishing factories in the US has become essential, as numerous...
Thursday 28 November 2024
Taiwan-made DUV photoresist likely to complete terminal production line verification by end of 2024
Although the US and Dutch governments have banned ASML from selling extreme ultraviolet (EUV) and advanced deep ultraviolet (DUV) lithography equipment to China, sales and after-sales...
Thursday 28 November 2024
Equipment supplier gives hints at FOPLP development progress among Taiwanese companies
Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
Thursday 28 November 2024
Taiwan to power AI data center expansion with hydrogen tech
Through collaborations with US-based Bloom Energy, Taiwan is accelerating its AI data center development, with power supply emerging as a critical challenge. The government plans...
Wednesday 27 November 2024
Kian Sheng leverages EV subsidies and tourism revival to boost Chinese operations
Kian Sheng, a subsidiary of the Yulon Group, plays a pivotal role in Taiwan's electric bus supply chain. Despite challenges, the company's operations in China achieved notable results...
Wednesday 27 November 2024
Hisense, TCL shake up 3Q24 premium TV market share rankings
Samsung Electronics maintained its leadership in the global premium TV market during the third quarter of 2024, despite a notable decline from the same period in 2023. Conversely,...
Wednesday 27 November 2024
Mitsubishi Electric invests in new power semiconductor back-end factory
Mitsubishi Electric is ramping up its power semiconductor production in Japan to meet the surging demand fueled by the EV revolution and global climate change initiatives.
Wednesday 27 November 2024
SK Hynix announces 25% hike in dividend in new shareholder return program
SK Hynix Inc. announced today a new program on shareholder return for the 2025-27 period and the "Value Up" plan aimed at boosting corporate value.
Wednesday 27 November 2024
TSMC's CoWoS far from secure: Etron CEO flags Intel EMIB's rising threat
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
Wednesday 27 November 2024
Samsung executive reshuffle: new foundry head to boost Nvidia ties
Samsung Electronics (Samsung) has implemented a significant personnel adjustment within its Device Solutions (DS) division to regain competitiveness in the semiconductor sector. This...