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Sunday 13 September 2026
AI, 5G upgrades lift Taiwan's top three telecoms in August
Strong demand for AI and AI data centers, along with a wave of enterprise information and communications technology (ICT) projects moving into delivery, helped Taiwan's top three telecom...
Sunday 13 September 2026
AI server exports to US slow; electronics parts jump 1.5 times in August
Taiwan's Ministry of Finance on September 9 said electronic parts exports reached US$32.22 billion in August 2026, a record monthly high, rising US$11.83 billion, or 58%, from the...
Sunday 13 September 2026
AI server tracker: Taiwan optics race beyond 1.6T

Taiwan's optical communications supply chain is entering a more consequential phase of the AI infrastructure cycle. Demand is broadening...

Sunday 13 September 2026
HannStar to halve panel output as layoffs and a management exit fuel closure talk
HannStar Display is preparing to cut output at its only fab roughly in half, alongside a workforce reduction that industry sources put at as much as 70% — being carried out through...
Saturday 12 September 2026
Europe buys time in the LEO race as Eutelsat extends OneWeb toward the IRIS² era
Starlink's enormous low-Earth-orbit (LEO) footprint has long cast a shadow over the broader aerospace industry, turning satellite broadband into a race defined as much by constellation...
Saturday 12 September 2026
Renault sets 2-year car development quality line

Facing an aggressive push by Chinese automakers to launch new models at short intervals and rapidly seize market share, major automakers...

Saturday 12 September 2026
Apple foldable plans drive new demand for Japanese smartphone parts makers
Apple’s move into foldable smartphones is creating fresh business for Japanese component makers with expertise in thin, lightweight and compact designs. According to Nikkei...
Saturday 12 September 2026
Taiwan sees AI-era power upgrade openings in France
Taiwan's power and energy companies are looking to grow their presence in Europe. To support that push, the Chinese International Economic Cooperation Association (CIECA) organized...
Saturday 12 September 2026
ViTrox sees chip inspection moving upstream as advanced packaging raises defect costs
Advanced packaging is stretching semiconductor inspection in two directions at once: packages are getting larger while the features inside them are getting smaller.
Saturday 12 September 2026
Interview: Resonac maps five PLP hurdles, eyes 510x515mm pilot line
Advanced packaging is reshaping the semiconductor value chain, making materials innovation a key source of technical breakthroughs. As large-format panel-level packaging (PLP) gains...
Friday 11 September 2026
Taiwan unfazed by Trump's renewed chip tariff threat as MOU already locks in preferential US treatment
Ahead of Chinese President Xi Jinping's expected visit to the US on September 24, US President Donald Trump has again discussed the issue of bringing chip manufacturing back to the...
Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
Samsung Electro-Mechanics, LG Innotek vie in AI package substrates
At South Korea's recent KPCA Show 2026, Samsung Electro-Mechanics and LG Innotek showcased their next-generation package substrate technologies. As AI semiconductors evolve toward...
Friday 11 September 2026
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
Friday 11 September 2026
Taiwan govt boosts EDA R&D to target global gaps
Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...