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Monday 24 August 2026
AI energy bottleneck is driving semiconductor materials innovation, says Applied Materials
Rising demand for artificial intelligence (AI) computing is driving a new wave of technological transformation in the semiconductor industry, while energy is emerging as the next bottleneck...
Monday 24 August 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

Monday 24 August 2026
Taiwan's Iron Force shifts airbag output to Poland, targets AI server component ramp in 2027
Taiwan-based Iron Force Industrial is reshaping its manufacturing footprint as pressure on its traditional auto-parts business weighs on earnings. The company plans to expand its Poland...
Monday 24 August 2026
UAE weighs investment in 500 MW AI data center plan in Japan
The United Arab Emirates is considering backing a proposed 500 MW AI data center in Akita prefecture, Japan, after local officials met with the UAE ambassador on Aug. 19. The project,...
Monday 24 August 2026
Pixel 11 preorder surge lifts Google's Taiwan smartphone share
Google's newly launched Pixel 11 series drew a strong preorder response in Taiwan after telecom carriers rolled out expanded promotions and sales plans. The early momentum has renewed...
Monday 24 August 2026
German auto industry hardens stance against Chinese competition
Germany's top auto industry lobby, the German Association of the Automotive Industry (VDA), is overhauling its strategy as it hardens its stance on China. The group has said China...
Monday 24 August 2026
Taiwan semiconductor materials hit golden opportunity
Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...
Monday 24 August 2026
Europe's struggling auto industry turns to China, drawing US scrutiny

European automakers have been increasing collaboration with their Chinese counterparts in recent years, as they seek to break through...

Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
Monday 24 August 2026
Rapidus 2nm ramp stays on track as Japan readies JPY150 billion investment

Rapidus' plan to begin volume production of 2nm chips in the second half of FY2027 remains on schedule, with rising demand from AI chips...

Monday 24 August 2026
Fujifilm opens new post-CMP cleaner plant at Oita to meet AI chip demand
Fujifilm has completed a new production building at its Oita Factory in Japan to make post-CMP cleaners, expanding capacity for materials used in advanced semiconductors amid rising...
Monday 24 August 2026
SEMI launches alliance to ride semiconductor materials boom
SEMI launched a semiconductor materials alliance on August 21, bringing together more than 400 companies to build a more resilient and competitive supply chain as Taiwan extends its...
Monday 24 August 2026
Taiwan speeds chip materials push with consumables, ITRI says

Taiwan is accelerating its drive for semiconductor materials self-reliance by starting with consumables and building toward higher-value...

Monday 24 August 2026
ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026
Taiwan semiconductor materials team up to build local supply chain

Taiwan's semiconductor materials industry is entering a new window of opportunity as advanced semiconductor process and packaging technologies...