Taiwan's Resource Circulation Administration (RECA), under the Ministry of Environment, has launched an upgraded version of its Circular Redesign Center, with Environment Minister...

Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...

Japanese motor maker Nidec has replaced president and CEO Mitsuya Kishida with chief technology officer Michio Kaida as the company moves to overhaul its business and governance following...

Contemporary Amperex Technology Ltd. (CATL) said its new battery plant in Debrecen, Hungary, began cell trial production on September 22, with the first two cell production lines entering...

Production lines and testing facilities are now in place for the Taiwan-US attack drone Mighty Hornet IV, which is being developed by the National Chung-Shan Institute of Science &...

TDK and Taiyo Yuden have signed a memorandum of understanding to begin discussions on a business alliance to develop electronic components, including MLCCs and inductors jointly, the...

Taiwan-based chemical manufacturer Grand Pacific Petrochemical (GPPC) is optimizing its core business while actively expanding into high-tech and semiconductor materials-related industries,...

Taiwan-based server original design manufacturers (ODMs) have long been key partners for cloud service providers (CSPs) through the ODM-direct model, but the model's share is declining...

Rapid growth in AI server and high-speed networking demand since the second half of 2025 has tightened supply across printed circuit boards (PCBs), integrated circuit (IC) substrates,...

Amazon will take an equity stake in Gold Circuit Electronics (GCE), a Taiwanese maker of printed circuit boards (PCBs) for AI servers and network switches. GCE's board approved the...

ProLogium Technology said it has signed a joint testing agreement with Mercedes-Benz, giving the automaker priority access to evaluate the battery maker's latest Gen4 cells. The companies...

Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...

Amid the ongoing restructuring of the global semiconductor supply chain, Singapore is focusing on advanced packaging, heterogeneous integration, silicon photonics, and optical interconnects,...

Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...