Qualcomm is stepping up its deployments in 5G PC processors seeking to tap demand from the segments of both high-end commercial notebooks and lower-end education and consumer notebooks,...
Acer expects its monitor shipments to continue to grow by double-digit in the second quarter of 2021, having seen such shipments expand robustly in the previous quarter.
Osram Opto Semiconductors reportedly will become a new supplier of miniLED for backlighting Apple's new MacBook Pro lineup slated for launch in the second half of 2021, according...
With analog sales of US$10.9 billion and 19% marketshare, Texas Instruments (TI) maintained its firm grip as the leading supplier of analog devices in 2020, according to IC Insights...
Taiwan-based ACX, specializing in LTCC (low temperature co-fired ceramic) components for RF front-end modules, is set to complete a 40% capacity expansion in the third quarter, adding...
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
Taiwan-based Wendell Industrial, a supplier of EMC (electromagnetic compatibility) and other circuit protection components, is upbeat about its operations in the third quarter of...
PCB makers continue to see strong order momentum for notebook applications in the second half of the year, and are poised to make rolling updates to their quotes as prices of upstream...
Nvidia has announced the GeForce RTX 3080 Ti and 3070 Ti GPUs for content creators specializing in video editing, 3D animation or architectural visualization at Computex 2021.
The upcoming availability of new-generation GPUs will be stimulating the do-it-yourself PC market particularly the gaming PC segment in the second half of 2021, according to industry...
Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
