Qualcomm is expected to significantly enhance its partnership with Taiwan Semiconductor Manufacturing Company (TSMC) for the production of high-performance computing (HPC) chips for...

IoT applications can provide fertile soil for incubating unicorn startups, as long as startups can find key solutions in the process of developing creative IoT devices to satisfy...

Ericsson has taken a step to drive 5G commercial readiness by contracting Wistron NeWeb Corporation (WNC) to deliver 5G mobile devices for use in customer trials from the fourth quarter...

Qualcomm has announced that it will set up three technology and testing centers in Taiwan as it deepens its collaborative efforts with the local government and business concerns to...

The production value of the global foundry industry is expected to grow by a CAGR of 6.2% to reach US$81.94 billion in 2023, the final year of a five-year forecast period, driven...

Taiwan-based cooling module maker Taisol Electronics has reported consolidated revenues of NT$1.01 billion (US$32.33 million) for the third quarter, up 37% sequentially and 17% on...

Samsung Electro-Mechanics (SEMCO) under the Samsung group has been engaged in the development of fan-out panel-level packaging (FOPLP) technology for the production of application...

Globalfoundries and the Chengdu municipality have signed an amendment to their investment and cooperation agreement. Based on market condition changes, Globalfoundries' renewed focus...

Taiwan MLCC suppliers are planning to enforce capacity expansions in the next two years to cash in on expected robust demand in the 5G era, but industry sources said it will take...

As leading brand vendors are set to roll out 5G-based smartphone models in the first half of 2019, chipmakers such as Qualcomm and MediaTek have advanced the launch schedules for...

Qualcomm Technologies has announced what it calls the smallest additions to its QTM052 mmWave antenna module family of fully-integrated 5G NR millimeter wave (mmWave) modules for...

As 5G commercialization is set to kick off in 2019, global chipmakers including Qualcomm, Intel, MediaTek and UNISOC (Spreadtrum & RDA) are looking to expand their 5G solutions...

Digitimes Research estimates global smartphone shipments will not be able to break through the 1.5 billion unit mark by 2019 as 5G communication has yet to spur a wave of upgrades...

The notebook market will face unfavorable conditions in 2019 on both the supply side and demand side. Total shipments may dip further below the level seen in 2018.

Innodisk, a Taiwan-based provider of industrial embedded flash and DRAM solutions, is joining forces with its four subsidiaries and cooperative partners such as SuperMicro to build...