IoT applications will see brand-new development after 5G technologies and applications enter commercial runs in 2019, and all IoT devices must feature low power consumption and high...
Chunghwa Telecom (CHT) has signed a memorandum of understanding (MOU) with the Taipei city government for cooperation to develop 5G and smart city applications and services.
Passive component maker Walsin Technology has ramped up its investments in capacity expansion quarter by quarter since the beginning of 2018, with the investments to drive up capacity...
MWC Shanghai 2018 running from June 27-29 is highlighting 5G, AI, IoT and autonomous driving to serve as major agenda of the annual event held under the theme of "Discover a Better...
As part of their efforts to develop a preemptive presence in the 5G era, global chipmakers are stepping up the development of IoT chipset solutions as a warm-up game for exploring...
To embrace the advent of the 5G era, Huawei plans to launch commercial 5G solutions as well as 5G chips for smartphones in March 2019, according to company rotating and acting CEO...
Asia Pacific is on track to become the world's largest 5G region by 2025, led by pioneering 5G markets such as Australia, China, Japan and South Korea, according to the latest edition...
HTC is stepping up efforts to develop innovative technologies including VR/AR, AI, 5G and blockchain as it aims to reinvigorate its smartphone business by utilizing new applications...
Taiwan IC test solutions providers Chunghwa Precision Test Tech (CHPT) and Keystone Microtech are poised to embrace strong demand for high-caliber wafer probe cards, final test cards,...
The fifth generation (5G) mobile network communication and artificial intelligence (AI) technologies continue to grab the public's attention, and will do so into the next year and...
Taiwan Semiconductor Manufacturing Company (TSMC) has started commercial production of chips built using 7nm process technology, according to company CEO CC Wei. The foundry is also...
Pure-play foundry Taiwan Semiconductor Manufacturing Company (TSMC) has been enhancing its IC packaging capability by developing system-level packaging technology.
Shunsin Technology, a subsidiary of Foxconn Electronics (Hon Hai Precision Industry) specializing in assembly and test of system-in-package (SiP) modules, has obtained new orders...
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