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Global supply chain: Key components
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IN THE NEWS
Thursday 28 December 2023
AI chip rivalry heats up: Micron and Intel challenge Samsung, SK Hynix and Nvidia dominance

As the artificial intelligence (AI) chip market gains momentum, major players are strategically exploring new avenues to capitalize on the growing opportunities. Companies...

Thursday 28 December 2023
Free-space optics indispensable as Taiwan's satellite development gains a military dimension
With photonic integrated circuits, above all silicon photonics, seeing a wave of industry hype owing to their vast potential in the datacom and telecom applications, relevant suppliers...
Thursday 28 December 2023
Automotive CIS inventory replenishments picking up
Market sources indicated that inventory replenishments for automotive CMOS image sensors (CIS) have been accelerating, with demand prospects bullish for 2024.
Thursday 28 December 2023
IC packaging material distributors expect brisk orders in 2024
As a result of the high demand for advanced packaging materials in 2024, IC packaging material distributors such as Chang Wah Technology (CWTC), Niching Industrial, Topco Scientific,...
Thursday 28 December 2023
Taiwan IC design houses to target diverse AI applications at CES 2024
As semiconductor companies gear up for CES 2024, Taiwanese IC design companies of all sizes, including major companies such as MediaTek, Realtek Semiconductor, and Himax Technologies,...
Thursday 28 December 2023
Taiwan wafer foundry industry, 4Q 2023
Taiwan's foundry industry thrives on advanced chip shipments and expects up to US$90 billion in revenues in 2024 despite a 1Q24 dip.
Thursday 28 December 2023
HiSilicon regaining smartphone AP market share
Huawei subsidiary HiSilicon has regained market share by supplying its Kirin chips for Huawei's midrange and high-end smartphones, according to market observers.
Wednesday 27 December 2023
Nvidia reportedly gives SK Hynix and Micron significant advance payments to secure HBM supply
It is reported that Nvidia has paid hundreds of millions of dollars in advance to SK Hynix and Micron to ensure a stable supply of High Bandwidth Memory (HBM). Recently, Samsung Electronics...
Wednesday 27 December 2023
ASML's latest High-NA EUV machines present procurement dilemma for chipmakers
With Samsung Foundry, TSMC, and Intel entering mass production of 3nm GAA, 3nm FinFET, and Intel 4 processes in 2022-2023, the three major semiconductor makers are gearing up to develop...
Wednesday 27 December 2023
AI tech patents: semiconductor equipment giants dominate, South Korean firms trail
As the global semiconductor equipment industry races to boost production efficiency, the infusion of AI into its processes has become the new norm. Yet, a rising worry within South...
Wednesday 27 December 2023
A paradigm shift in semiconductor materials development (1)
There are three ways to grow the economic scale in the modern-day semiconductor industry: continuous miniaturization of processes, advanced packaging, and the application of new ma...
Wednesday 27 December 2023
MediaTek CEO reiterates TSMC as a 3nm foundry partner
TSMC has scaled up its 3nm production output since the second half of 2023, thanks to the adoption of key customer Apple, and more customers will join and ramp up 3nm production in...
Wednesday 27 December 2023
MediaTek has become a 'system' company rather than a mere IC design house, says CEO
MediaTek is evolving into more than just an IC design house, according to company vice chairman Rick Tsai.
Tuesday 26 December 2023
Japanese tech giants Fujitsu and NEC gear up for 6G base stations with in-house chip development
As 5G gains ground, the sprint to 6G is in full swing. With global 6G standards potentially set for 2024, Japanese giants Fujitsu and NEC are revving up for self-made chips in 6G...
Tuesday 26 December 2023
PCB equipment maker Taliang stepping up deployment in the chipmaking sector
Taliang Technology will be stepping up its presence in the chipmaking industry, which presently contributes only 10% of the company's overall revenue, according to the PCB equipment...