Global supply chain: Key components

Key components news coverage

IN THE NEWS

Thursday 6 August 2026

Global smartphone AP industry, 2Q 2026: 2nm and memory costs to weigh on 3Q26 shipments

Thursday 6 August 2026

Taiwan unveils four semiconductor pillars for Smart Nation 2.0 plan

On August 5, Taiwan's National Science and Technology Council said it had completed the central government's 2027 budget plan, with...

Thursday 6 August 2026

Parade sees steadier outlook despite margin pressure from memory costs

Parade said its second-quarter 2026 results were squeezed by a sudden increase in back-end testing and packaging costs, but the high-speed...

Thursday 6 August 2026

SpaceX losses don't shake confidence as Taiwan suppliers double down on long-term opportunities

SpaceX's first earnings report since going public showed that second-quarter 2026 revenue surged 92% year-over-year to US$7.81 billion, while the company still posted a net loss of...

Thursday 6 August 2026

Nuvoton sees PC pressure ease as AI, cloud demand and quantum-security projects advance

Nuvoton Technology is navigating weaker PC-related demand as memory shortages reshape global hardware orders, while cloud, AI, and security products gain momentum. The company said...

Thursday 6 August 2026

AUO warns of 2H26 panel demand pressure

AUO said panel demand will come under pressure in the second half. IT channel inventories remain elevated, with notebook inventories...

Thursday 6 August 2026

Anthropic builds in-house chip design team, signaling AI firms' turn to custom silicon

Anthropic is building an in-house team to design custom chips for its Claude AI models, according to Reuters, moving ahead...

Thursday 6 August 2026

Machvision July revenue hits record as AI and PCB demand strengthens

Machvision reported consolidated revenue of about NT$359 million (US$11.1 million) in July 2026, a record monthly high that was up 1.28% from June and 31.84% from a year earlier. The...

Thursday 6 August 2026

FOPLP leads production as CoPoS advances glass packaging

AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...

Thursday 6 August 2026

GlobalWafers says AI demand is lifting utilization and new LTA talks are underway

GlobalWafers said semiconductor demand has rebounded as AI and high-performance computing applications expanded, keeping its factories highly utilized and prompting a new round of...

Wednesday 5 August 2026

Airoha optical comms revenue doubles as broadband lands CSPs

Airoha sees faster growth ahead as AI infrastructure, optical networking, and wireless edge products expand across global supply chains. The chip designer said its 2026 product mix...

Wednesday 5 August 2026

AMD says server CPU market to hit US$220B by 2030

AMD expects the market for server central processing units (CPUs) to reach approximately US$220 billion by 2030, up from an estimate...

Wednesday 5 August 2026

Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Wednesday 5 August 2026

Macroblock returns to profit as display demand and new products support outlook

Macroblock's return to profitability in the second quarter points to a steadier recovery in the LED display supply chain, with implications for customers and competitors across Asia,...

Wednesday 5 August 2026

AMD says US$30 billion estimate for 2027 Instinct revenue may be too low

AMD CEO Lisa Su indicated during the company's second-quarter 2026 earnings call that an estimate of roughly US$30 billion in 2027 Instinct...

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