Kingboard Laminates Holdings (KB Laminates), a leading Chinese manufacturer, announced its eighth price increase of 2026 on October 13, raising prices by 15% for laminates and prepreg...

Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...

Nvidia's share of AI chips in China's data center market has fallen by 34% in the first half of this year, according to a new report. The drop follows months of US restrictions on...

Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...

At Plug and Play Taiwan's Batch 4 Selection Day, 21 startups made the case that Taiwan's next wave of innovation is being built by chip-industry veterans who are tackling problems...

The AI accelerator market is set to reach US$1.4 trillion by 2030, up 150% from Bloomberg Intelligence's January 2026 estimate of US$560 billion, as higher prices—not just shipment...

Hua Hong Group signed strategic agreements with four Chinese semiconductor equipment suppliers at the inaugural 2026 China Integrated Circuit Exhibition (China Chip Exhibition) in...

Memory IC design house AP Memory Technology has successfully priced its global depositary receipt (GDR) offering, raising a total of US$415.5 million. The GDRs were priced at US$56.15...

SEMI announced at a media event during SEMICON West 2026 that the exhibition will move to Phoenix, Arizona, in 2027 and shift to a spring schedule. SEMI Americas President Joe Stockunas...

Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...

China's domestic AI chipmakers are shifting their competitive focus from individual GPU performance to system-level integration as AI models grow increasingly complex. Three priorities—3D...

Foxconn Technology Group showcased rack-scale artificial intelligence infrastructure at the Open Compute Project (OCP) Global Summit 2026 in San Jose, California, combining computing...

Indian semiconductor engineering services firm Tessolve has raised US$75 million from US-based Vector Line Capital and says it is in advanced discussions to close multiple acquisitions...

Entering the fourth quarter of 2026, panel makers face pressure from rising component costs and weakening demand. However, price hikes and production cuts led by Chinese panel manufacturers...

Shenzhen-based Blue Core Computing (Shenzhen) Technology has raised nearly CNY2 billion (≈ US$298.7 million) in Series B financing to accelerate production of its RISC-V server...