Global supply chain: Key components

Key components news coverage

IN THE NEWS

Monday 19 October 2026

IBM and Siemens collaborate to advance nanostack chip architecture

IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance,...

Monday 19 October 2026

Von Ardenne's flexible equipment targets unsettled panel-level packaging market

German equipment maker Von Ardenne is entering the semiconductor industry with coating technology aimed at panel-level packaging, a segment where the choice among competing panel dimensions...

Monday 19 October 2026

Shipments of high-end cloud AI accelerators, 2027

DIGITIMES observed that cloud service providers (CSPs) such as Google and AWS will sharply ramp up self-developed ASICs in 2027, lifting high-end cloud AI accelerator shipments to...

Monday 19 October 2026

TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D

South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...

Monday 19 October 2026

Malaysia unveils six locally designed chips, but commercial adoption is the real test

Malaysia's push to move from assembling chips to owning the designs behind them has reached the point where it must find buyers. On October 16, the government unveiled six semiconductor...

Monday 19 October 2026

Chenming Hu urges universities to 'find the solutions', targets world-class Taiwan semiconductor sector

Academia Sinica academician Chenming Hu has published an autobiography titled Find the Solutions, taken from the words on a crystal plaque presented to him by then TSMC chairman...

Monday 19 October 2026

India roundup: Tata chip bets face execution test as India semiconductor ecosystem expands

Tata's Dholera fab faces customer and shareholder tests as India's semiconductor push broadens, with packaging, chip services, AI hardware and...

Monday 19 October 2026

MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026

MKS Inc. (NASDAQ: MKS), a global provider of enabling technologies that transform our world, today announced that its strategic brands Atotech, offering process chemicals,...

Friday 16 October 2026

AI server tracker: semiconductor testing and design services rally on compute demand

Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial...

Friday 16 October 2026

Bolt Graphics seeks US$100 million to challenge Nvidia, AMD beyond AI with Zeus GPU

US chip startup Bolt Graphics is seeking approximately US$100 million at a valuation of about US$700 million to develop graphics processors targeting scientific computing and professional...

Friday 16 October 2026

Holtek targets higher-value MCU markets with AI server cooling orders set to lift 2027 revenue

Taiwan-based microcontroller (MCU) manufacturer Holtek Semiconductor unveiled its 2026 product roadmap on October 15, focusing on four core areas: smart protection, green energy and...

Friday 16 October 2026

Analysis: Intel CEO Lip-Bu Tan's power of humility — how one phone call helped reshape the chip giant's comeback

As the semiconductor industry enters the artificial intelligence (AI) era, Intel, once the dominant force in the PC market, has increasingly been viewed as a company that fell behind...

Friday 16 October 2026

LCD TV panel prices struggle to rise in 4Q26

LCD TV panel prices face a tug-of-war in the fourth quarter of 2026 as panel makers push for increases while LCD TV brands maintain relatively steady purchasing and contract manufacturers...

Friday 16 October 2026

BOE's 24-layer glass substrates reach AI chip packaging trials, with mass production still ahead

Chinese display manufacturer BOE has made further progress in advanced semiconductor packaging, extending its panel manufacturing expertise to glass-core packaging substrates. At an...

Friday 16 October 2026

China's chip earnings boom masks a widening gap between AI processor demand, fading DRAM, NAND price gains

China's semiconductor and computing hardware companies reported or forecast strong earnings growth in the first nine months of 2026, fueled by AI infrastructure investment, demand...

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