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Monday 22 June 2026
Groq CEO sees GPU and LPU as complementary as AI compute demand grows
Nvidia's planned US$20 billion strategic deal with Groq is built on a simple logic: as compute gets cheaper, demand keeps expanding. In a recent interview, Groq co-founder and CEO...
Monday 22 June 2026
Intel-Nvidia co-developed PC processor to reportedly debut at CES 2028

According to an exclusive report by VideoCardz, Intel's first x86 system-on-chip (SoC) integrating an Nvidia RTX GPU has been...

Monday 22 June 2026
ASMedia launches second transformation plan, targets revenue doubling, AI server market expansion
High-speed transmission IC design company ASMedia Technology held its annual shareholders meeting on June 17, completing a full board reshuffle. ASMedia president Che-Wei Lin stated...
Saturday 20 June 2026
FPGA firm Efinix lines up TSMC Japan fab as edge AI business grows
Efinix, a Cupertino-based FPGA startup founded in 2012, is making a push into edge AI with its newly launched Titanium Edge series — a family of chips the company says addresses...
Friday 19 June 2026
Apple to work with Intel on US chip design and manufacturing, Trump says
US President Donald Trump said on June 18 that Apple has agreed to work with Intel to design and manufacture chips in the US, a claim he made in a post on his Truth Social platform...
Friday 19 June 2026
Interview: Oppstar grows ASIC design ties with Japan, South Korea clientele, plans Taiwan office

Founded in 2014, Oppstar is one of the few Malaysian companies operating at the front end of the semiconductor value chain as an IC...

Thursday 18 June 2026
Elon Musk aims for record maximum usable compute per wafer for AI6 chip
Following the announcement in April 2026 that the AI5 chip design had been finalized, Tesla CEO Elon Musk introduced a new benchmark, stating that under yield considerations, the AI6...
Thursday 18 June 2026
FOPLP race heats up as Innolux reportedly teams with TSMC
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP...
Thursday 18 June 2026
Samsung to offer 2nm prototype runs as South Korea pushes chip design

Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South...

Thursday 18 June 2026
SK Hynix scraps degree rules to court AI chip talent

SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks...

Thursday 18 June 2026
WUS and its subsidiary keep complementary AI partnership
A recent open letter from the UK-based fund Palliser Capital called Taiwanese printed circuit board (PCB) maker WUS Printed Circuit one of the most undervalued AI PCB companies in...
Wednesday 17 June 2026
Li Auto's new automotive chip and what it says about China's EV market

Li Auto announced details of its new Mach M100 chip, a self-developed 5nm chip focused on autonomous driving, on June 15. This development...

Wednesday 17 June 2026
China PCB maker DSBJ bets US$1.2 billion on AI optical modules
Suzhou Dongshan Precision Manufacturing (DSBJ) will invest US$1.2 billion to expand optical chip and optical module capacity at Source Photonics, accelerating its shift from PCB manufacturing...
Wednesday 17 June 2026
InnoScience wins GaN patent battle against Infineon in China
InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power...
Wednesday 17 June 2026
PCIM 2026: How high-voltage infrastructure is unifying AI and e-mobility sectors
Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate...