Global supply chain: Key components

Key components news coverage

IN THE NEWS

Thursday 12 March 2026

Taiwan IC designers in rack-level AI delivery

Rack-level delivery becomes a mainstream trend in cloud AI compute; MediaTek joins TPU design, influencing Taiwan's IC design status.

Thursday 12 March 2026

Ardentec launches ASIC wafer test collaboration; new Longtan capacity to be ready by 2H26

Semiconductor testing firm Ardentec is optimistic about its future operations, driven by sustained strong orders in communication applications. The company expects a resilient first...

Thursday 12 March 2026

Apple locks in book-style foldable iPhone, targets fall 2026 launch with 20% production boost

Apple has reportedly finalized the design of its first foldable iPhone, tentatively called the iPhone Fold, choosing a book-style form factor and targeting a fall 2026 launch. As market...

Thursday 12 March 2026

ASE's Dr. Tien Wu shares three key trends as global semiconductor output to surpass US$1 trillion

The global semiconductor industry is set to hit US$1 trillion ahead of schedule. ASE Technology Holding COO Dr. Tien Wu revealed that the latest forecast from Semiconductor Equipment...

Thursday 12 March 2026

MediaTek bets on TSMC 3nm Genio Pro to serve high-end IoT needs while acknowledging limited demand

At Embedded World 2026, MediaTek unveiled the Genio Pro series, its flagship IoT platform built on TSMC's 3nm process, and said the market now requires both power-efficient mid-to-low-end...

Thursday 12 March 2026

Nvidia invests US$2 billion in Nebius to build next-generation hyperscale AI cloud

Nvidia and Nebius Group announced a strategic partnership to develop and deploy a next-generation hyperscale cloud for the AI market, designed to serve both AI-native and enterprise...

Thursday 12 March 2026

Taiwan leads Embedded World 2026 with largest exhibitor presence; targets 'non-red supply chain' demand

Embedded World 2026 officially opened on March 10 in Nuremberg, Germany, featuring a particularly large turnout of Taiwanese participants. Taiwan emerged as the country with the most...

Wednesday 11 March 2026

MediaTek Genio platform launches new 3nm flagship targeting high-end AIoT image processing demands

This week at Embedded World 2026 in Nuremberg, Germany, MediaTek unveiled a series of new Genio platforms designed to empower various Internet of Things (IoT) products and applications,...

Wednesday 11 March 2026

WT Microelectronics posts 89% revenue surge in 2 months on AI and market recovery

IC distributor WT Microelectronics reported consolidated preliminary revenue of NT$104.4 billion (US$3.28 billion) for February 2026, up about 29% year over year. For the first two...

Wednesday 11 March 2026

Japan's investment list targets AI, quantum computing, and semiconductors

Japan selected 61 products and technologies for priority investment, including 27 items already under early review, such as physical AI systems, regenerative medicine, quantum computing,...

Wednesday 11 March 2026

Texas Instruments reportedly plan analog chip price hikes

Market sources say analog chip design leader Texas Instruments (TI) is preparing to raise prices on a range of semiconductor products...

Wednesday 11 March 2026

MediaTek CEO: Advanced chip production due for a global rebalance

MediaTek CEO Ricky Tsai recently discussed artificial intelligence, semiconductor geopolitics, and MediaTek's evolving strategy in an interview with an English-language publication...

Wednesday 11 March 2026

Jarllytec expects short-term trough as new hinge shipments begin

Bearing manufacturer Jarllytec said February 2026 will be a short-term operational trough as it ships new Chinese foldable smartphone hinges, with gradual recovery expected as shipments...

Wednesday 11 March 2026

Nvidia narrows CoWoP PCB partners to three amid advanced packaging crunch

Advanced packaging capacity is tightening, and Nvidia is quietly pushing its Chip-on-Wafer-on-PCB (CoWoP) technology forward. The company is working with PCB, semiconductor packaging,...

Tuesday 10 March 2026

Rugged device maker Winmate sees growth surge from edge AI and defense demand

Industrial PC maker Winmate reported stronger-than-expected revenue in February 2026, supported by expanding demand for edge AI computing...

1/1965 pages