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IN THE NEWS
Thursday 24 September 2026
Beijing Eswin heads for HK IPO as RISC-V growth shifts to autos, industrial chips
Beijing Eswin Computing Technology has cleared its Hong Kong Stock Exchange listing hearing, moving closer to becoming the market's first listed RISC-V-focused chip company.
Thursday 24 September 2026
Qualcomm splits flagship mobile SoCs into more tiers
Qualcomm is launching two flagship platforms in 2026—the Snapdragon 8 Elite Gen 6 and the Snapdragon 8 Elite Extreme Gen 6—signaling a new era of finer-grained flagship...
Thursday 24 September 2026
Qualcomm pushes Snapdragon PCs further into Linux, GoogleBook as AI shifts to the device edge

Qualcomm used the second day of its Snapdragon Summit 2026 to underline a broader shift for Snapdragon-powered PCs, announcing Linux...

Thursday 24 September 2026
TSMC locks in 3-6% wafer out price hikes for 2027

TSMC is reportedly planning another wafer foundry price increase, with supply chain sources saying its order visibility now extends...

Thursday 24 September 2026
Qualcomm bets on earphones as the voice gateway for personal AI
Qualcomm used its keynote on the second day of Snapdragon Summit 2026 to argue that earphones, glasses, and other wearables will shape the next phase of AI computing. For global consumers...
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Thursday 24 September 2026
Garmin drops Micro LED after 1 year, returns to OLED

The commercial adoption of Micro LED display technology is facing another major setback. Just one year after making waves with the world's...

Thursday 24 September 2026
Alibaba Zhenwu V900 joins Huawei Ascend 960 in race to fill Nvidia's China AI compute gap
Alibaba has formally unveiled its self-developed Zhenwu V900 AI chip at the 2026 Apsara Conference, with CEO Eddie Wu describing the T-Head Semiconductor-designed processor as "China's...
Thursday 24 September 2026
Qualcomm's PickNik deal brings robotics software to its edge AI push
MoveIt's integration with Qualcomm's Dragonwing and Arduino platforms could give robot builders a more direct route from on-device AI to motion planning and control, while also testing...
Thursday 24 September 2026
Trump-Xi pre-summit watch: H20 setbacks and Ascend gains reshape China's Nvidia calculus
Ahead of the Trump-Xi summit, the key semiconductor question is no longer simply how much Nvidia hardware Washington will allow China to buy.
Thursday 24 September 2026
Microsoft reframes AI ROI calculations, keeps in-house ASICs for internal use

Microsoft is changing how companies evaluate their generative AI investments, as the technology evolves from its beginnings as a productivity...

Wednesday 23 September 2026
Vivo launches camera monitor accessory, stoking panel demand
Vivo officially unveiled its new flagship X500 series smartphones in Shanghai on September 21, along with wearable accessories including smartwatches and earphones. The X500 series...
Wednesday 23 September 2026
Automotive display growth shifts to HUDs, passenger screens

The global automotive display market is entering a new phase of growth, with demand shifting away from central consoles and instrument...

Wednesday 23 September 2026
ZDT prices US$800M ECB to expand AI server PCB push

Printed circuit board (PCB) maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond issue on...

Wednesday 23 September 2026
MediaTek, Qualcomm target Googlebook with Arm push
Preorders have officially opened for "Googlebook," Google's new laptop category purpose-built for Gemini Intelligence. IC design powerhouses Qualcomm and MediaTek announced their entry...