Global supply chain: Key components

Key components news coverage

IN THE NEWS

Monday 24 August 2026

Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving

Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...

Monday 24 August 2026

Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials

As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...

Monday 24 August 2026

Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models

Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's...

Monday 24 August 2026

Taiwan semiconductor materials hit golden opportunity

Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...

Monday 24 August 2026

MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital

Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...

Monday 24 August 2026

AI chip roadmaps force faster changes in data-center design, Cadence says

Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...

Monday 24 August 2026

ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026

Jeilin shifts upmarket as high-end image SoCs drive margins higher

Jeilin's move into higher-end image-processing chips is reshaping its revenue mix and boosting profitability, with implications for cameras, security devices, and drones used by customers...

Monday 24 August 2026

iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026

Interested in solving microcrack issues in through-glass via (TGV) fabrication? Want to learn how to supply 1,000 Watts, 1 Volt and 1,000 Amperes electricity to semiconductor...

Monday 24 August 2026

AI compute race heads toward space as MediaTek executive says 1 million H100s will be mid-tier by 2030

Speaking at DIGITIMES' "AI on Chips: Semiconductor Industry Outlook Forum," MediaTek senior director Bor-Sung Liang said AI development is shifting from individual large language models...

Monday 24 August 2026

Agentic AI opens new era for humanoid robots, shipments to jump fourfold by 2030

Humanoid robots have entered a clear new phase since agentic AI emerged in 2025, with DIGITIMES analyst Zouhao Shen saying the category...

Monday 24 August 2026

Research Insight: ASIC shipments projected to overtake GPU by 2027 as AI reshapes memory

ASIC and GPU shipments will reach a "golden cross" in 2027, with ASIC shipments expected to surpass GPU shipments for the first time at 15.3 million units, DIGITIMES Intelligence analyst...

Saturday 22 August 2026

Interview: Arbe Robotics on why radar is needed for autonomous driving and beyond

Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers...

Saturday 22 August 2026

Manz Asia says yield is key to glass core mass production

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies...

Friday 21 August 2026

Cambricon advances sixth-gen AI silicon, broadens support for DeepSeek, Qwen and GLM

Cambricon Technologies chairman and president Chen Tian-shi said the company's sixth-generation AI processor and instruction set remain under development, with the next-generation...

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