Physical AI that can sense, reason, control machines and interact with people, Salil Raje, senior vice president of AMD's Embedded Computing Group, said TOPS (trillions of operations...

DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...

PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...

The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.

Chinese tech giants ByteDance, Alibaba, and Tencent have collectively ordered more than 3 million units of Nvidia's new RTX PRO 5500 graphics cards, representing a total value exceeding...

Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...

South Korean IC design firm LX Semicon has deployed AI agents in the development of display driver ICs (DDIs), reducing the design time for a benchmark image-processing engine from...

TPCA Show Taipei 2026, organized by the Taiwan Printed Circuit Association (TPCA), opened on October 20. Unimicron Technology chairman S.C. Chien delivered a keynote at the opening...

Nvidia is positioning its Vera CPU as a central component of data-center infrastructure for agentic artificial intelligence, as multistep reasoning and tool calls increase demand for...

Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...

TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...

Tongtai Machine & Tool said it had order visibility for its printed circuit board (PCB) drilling equipment through the end of 2027 as AI infrastructure demand increased pressure...

AUO is tailoring its glass core substrate specifications specifically to semiconductor process requirements rather than competing on panel dimensions with Innolux, according to Chairman...

China's Hygon Information Technology reported a 57.58% increase in revenue for the first nine months of 2026, reflecting sustained demand for domestic high-performance processors and...

DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...