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Saturday 15 August 2026
Gelsinger calls HBM 'lousy', SK Hynix says it's not memory's final answer

High-bandwidth memory (HBM), a core component in AI semiconductors, has drawn fresh scrutiny after former Intel CEO Pat Gelsinger called...

Saturday 15 August 2026
MicroIP sees second-half revenue lift as board approves cash raise
MICROIP, which focuses on AI software design services and ASIC design services, said its first-half 2026 financial report showed continued investment in core technologies and key IP...
Saturday 15 August 2026
Taiwan approves NT$8 billion ocean tech program for security and industry
Taiwan's government approved a four-year ocean technology and industry development program for 2027-2030 and will seek more than NT$8 billion in funding. The plan was designed to strengthen...
Saturday 15 August 2026
Interview: Acrab CEO Ken Phua on building agentic AI silicon in Singapore
Ken Phua, former Arm China co-CEO, spent 25 years abroad building someone else's business model. He came home to Singapore to build his own.
Friday 14 August 2026
China AI chip demand lifts Hygon revenue 67%, Sugon profit 34% as domestic computing expands

Hygon Information posted a 66.5% increase in first-half 2026 revenue as accelerating artificial intelligence deployment and stronger...

Friday 14 August 2026
OCP APAC 2026: What if AI's next efficiency breakthrough is simply moving less?

For years, the logic of AI infrastructure has been straightforward: move more data, push more power, transmit more signals, remove...

Friday 14 August 2026
Chinese analog chipmaker Novosense returns to profit on AI server, auto demand
Suzhou Novosense Microelectronics expects to return to profitability in the first half of 2026, with revenue rising nearly 67% as demand for AI computing infrastructure, automotive...
Friday 14 August 2026
AMD reportedly to issue up to US$5B in bonds amid tech debt sale wave
Advanced Micro Devices (AMD) is launching up to US$5 billion in debt offerings, part of a wave of tech companies reaching for capital markets to fund investments in AI-driven technologies...
Friday 14 August 2026
Intel's US$20B equity raise puts Lip-Bu Tan's turnaround strategy to the test

Intel has priced the largest equity raise in its history, selling 210,526,315 shares of common stock at US$95 per share to raise roughly...

Friday 14 August 2026
Silicon Motion completes US$1.15 billion zero-coupon bond offering
Silicon Motion Technology has completed a US$1.15 billion convertible bond sale, giving it fresh capital to support growth and debt repayment. For global investors and chip buyers,...
Friday 14 August 2026
Alibaba Cloud launches Zhenwu M890 supernode for commercial use
Alibaba Cloud has begun commercial service for its Zhenwu M890 supernode in Ulanqab, Inner Mongolia, giving global customers an early look at how AI infrastructure is shifting toward...
Friday 14 August 2026
China PCB makers pour billions into AI server, HPC, optical markets
Chinese printed circuit board (PCB) makers are stepping up investment in higher-value markets including AI servers, high-performance computing (HPC) and optical communications. Following...
Friday 14 August 2026
Samsung chip design embraces AI, but loss of control and hallucinations remain a problem
The AI wave is sweeping through the chip industry, but hallucinations, loss of control, and cybersecurity risks remain unresolved even as efficiency leaps. Youngsik Kim, head of the...
Friday 14 August 2026
SK Hynix advances Yongin fab construction for 2027 cleanroom launch
SK hynix has pushed construction of its semiconductor campus in Yongin, Gyeonggi Province, South Korea, to 87% completion as it targets February 2027 for the start of operations at...
Friday 14 August 2026
Rapidus targets 8-reticle interposers by 2030
Rapidus expects interposers for high-performance chips to reach eight-reticle scale by around 2030, as larger chiplets and high-bandwidth memory (HBM) push advanced packages toward...