CONNECT WITH US
Global supply chain: Key components
Key components news coverage
IN THE NEWS
Thursday 26 March 2026
Semicon China 2026: Siemens EDA pushes agentic AI to cut chip design cycles in half
At the SEMICON China 2026 opening keynote, Siemens EDA IC Products Executive Vice President (EVP) Ankur Gupta delivered a clear message: traditional EDA software is no longer sufficient,...
Thursday 26 March 2026
Nuvoton and Tower agree on framework to restructure joint Japanese foundry operations
Nuvoton and Tower have agreed to restructure their joint Japanese operations, a move that could reallocate fabs and services and affect global semiconductor supply chains and customer...
Thursday 26 March 2026
SEMICON China opens with focus on AI chips and advanced packaging
SEMICON China 2026 opened on March 25 in Shanghai, as the global semiconductor industry enters a new expansion cycle fueled by the rapid rise of artificial intelligence.
Thursday 26 March 2026
China's Naura and AMEC lead China's push into advanced chip packaging
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Thursday 26 March 2026
Nvidia and Emerald AI partner with utilities to build grid-responsive AI data centers
Nvidia and Emerald AI said on Tuesday that they are joining forces with a group of major US power producers — including AES Corporation, Constellation Energy, Invenergy, NextEra...
Thursday 26 March 2026
US senators accuse Nvidia CEO of misleading claims, urge halt to AI chip exports
US Senators Jim Banks and Elizabeth Warren, in a joint letter dated March 23, called on US Commerce Secretary Howard Lutnick to suspend Nvidia's export licenses for advanced AI chips...
Thursday 26 March 2026
Four reasons that Aspeed dominates the BMC chip market
As Taiwan-based IC design firms face declining global market share due to China, Taiwan's Aspeed stands out by dominating the baseboard management controller (BMC) chip sector.
Thursday 26 March 2026
Broadcom to mass-produce 400G single-lane PAM4 DSP by 2027, vows to maintain lead
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling...
Wednesday 25 March 2026
With Hua Hong partnership, STMicro builds 'China for China' supply chain
STMicroelectronics said this week that its STM32 microcontrollers, produced in partnership with Hua Hong Semiconductor, have entered volume production in China and are now being shipped...
Wednesday 25 March 2026
Tescan targets Taiwan and South Korea for semiconductor investment
Czech microscopy equipment supplier Tescan is continuing to deepen its presence in the Asia-Pacific market, targeting growing opportunities in semiconductor failure analysis (FA)....
Wednesday 25 March 2026
Taiwan chipmakers chase drone imaging edge with thermal and AI
Non-China supply chains in the drone sector are emerging as a new battleground for global technology vendors, with Taiwan's chipmakers increasingly expanding into the space. Among...
Wednesday 25 March 2026
Arm defends shift into chips as AGI CPU targets agentic AI demand
Arm unveiled its first "Arm AGI CPU" on March 24 at its Arm Everywhere event, marking a major shift in its business model. The chip, conceived three years ago and now ready for mass...
Wednesday 25 March 2026
China-South Korea panel war escalates: USPTO rejects Tianma patent challenge
The US Patent and Trademark Office has rejected an attempt by Tianma Microelectronics to challenge a patent held by LG Display, citing concerns that the Chinese company may be under...
Wednesday 25 March 2026
Analysis: Qualcomm restructures Asia operations, giving Taiwan greater strategic weight
At a spring banquet in Taiwan, Qualcomm used the occasion not only to recap highlights from its recent appearances at major industry exhibitions, but also to underscore the growing...
Wednesday 25 March 2026
Agentic AI shift puts CPUs at the core as Arm rolls out first chip
Arm has officially launched the Arm AGI CPU, a new class of mass-production-ready processor built on its Neoverse platform and designed to power next-generation AI infrastructure....