Global supply chain: Key components

Key components news coverage

IN THE NEWS

Wednesday 19 August 2026

Manz Asia targets PLP demand with three lines and three sizes

Manz Asia is broadening its push into panel-level packaging (PLP) as interest in the technology continues to rise. General manager Robert Lin said the company has shipped more than...

Wednesday 19 August 2026

Nvidia H200 chips reach China as imports remain limited

ByteDance and Tencent have each received about 10,000 Nvidia H200 processors in mainland China in recent weeks, the Financial Times reported, marking the clearest sign yet...

Wednesday 19 August 2026

Taiwan seeks shift from drone supplier to strategic partner in entering US market

Industry figures and analysts from Taiwan and the United States gathered on August 19 at an international unmanned aerial vehicles (UAVs) forum to discuss how Taiwan can move beyond...

Wednesday 19 August 2026

Socionext taps Intel 18A-P process for high-performance compute chiplet development

Custom System-on-Chip (SoC) designer Socionext has selected Intel Foundry's 18A-P process node to build its next-generation custom silicon, aiming to accelerate workloads across data...

Wednesday 19 August 2026

PLP splits roles as FOPLP focuses on cost and CoPoS courts AI chips

As AI chips move toward larger dies and higher integration, advanced packaging is shifting from 300mm wafers to square panel manufacturing. In panel-level packaging (PLP), FOPLP and...

Wednesday 19 August 2026

Google and AMD target post-GPU era with Frozen v2 and Taalas

Advanced Micro Devices (AMD) recently announced its acquisition of Canadian AI chip startup Taalas to sharpen its competitive edge in AI inference. Taalas' core technology bakes model...

Wednesday 19 August 2026

BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC

DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving...

Wednesday 19 August 2026

Modi to inaugurate Semicon India 2026 as government courts global chipmakers

Indian Prime Minister Narendra Modi will inaugurate the fifth edition of Semicon India on September 17 at Yashobhoomi (India International Convention and Expo Centre) in New Delhi,...

Wednesday 19 August 2026

Google's v10 TPU opens door to AMD without sidelining Broadcom, MediaTek

Market speculation that AMD is working with Google on technology for its v10-generation tensor processing unit (TPU) has prompted questions...

Wednesday 19 August 2026

Airoha and MediaTek back IC Plus against Realtek in switches

Ethernet chipmaker IC Plus said on August 17 that its operations in 2026 have improved significantly after Airoha Technology took a...

Wednesday 19 August 2026

Amber's Oppo deal signals India's shift from smartphone assembly to deeper electronics manufacturing

Amber Enterprises India's planned entry into smartphone manufacturing could mark a further step in India's effort to move beyond final...

Wednesday 19 August 2026

Samsung moves ahead of SK Hynix in 1d DRAM development race

Samsung Electronics is reportedly on track to complete development of 10-nanometer-class seventh-generation DRAM, also known as 1d DRAM,...

Wednesday 19 August 2026

AI drives EISO high-end PCB orders as CCL shortages bite

Niche printed circuit board (PCB) maker EISO Enterprise said that 2026 industry demand has returned to post-pandemic highs as AI applications...

Tuesday 18 August 2026

Rockchip profit jumps 62% as edge AI chips scale across devices

China AIoT chip designer Rockchip posted record first-half 2026 results, with revenue rising 40.6% year on year to CNY2.88 billion (US$427...

Tuesday 18 August 2026

VeriSilicon revenue surges 91% as AI ASIC backlog swells to US$1.85B

VeriSilicon posted record first-half 2026 revenue of CNY1.86 billion (US$276 million), up 91.37% year-on-year, as AI computing demand...

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