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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Friday 10 April 2026
Spingence and Advantech accelerate AI edge deployment plans in South Korea manufacturing
In response to strong demand for data security and on-premises AI deployment within South Korea's manufacturing and semiconductor sectors, Taiwanese AI company Spingence Technology...
Friday 10 April 2026
Exclusive: SpaceX delays FOPLP, PCB yield as execs plan April Taiwan visit
Elon Musk's SpaceX is facing production challenges at its newly built fan-out panel-level packaging (FOPLP) and printed circuit board (PCB) factories in Texas, delaying full-scale...
Friday 10 April 2026
Why South Korean panel makers see rising profits despite chip price inflation
Amid rising chip prices, the industry generally anticipates a downturn in the mobile phone and notebook markets in 2026. For South Korea's panel industry, however, optimism continues...
Friday 10 April 2026
Intel–Google alliance reframes AI infrastructure around CPUs
A newly expanded collaboration between Intel and Google signals a key shift in AI infrastructure: CPUs are back at the center of the conversation. Both companies emphasized that the...
Friday 10 April 2026
Amazon signals chip export ambitions as in-house silicon business tops US$20 billion run rate
Amazon's custom chip business has surpassed an annual revenue run rate of more than US$20 billion, CEO Andy Jassy said in his annual shareholder letter, according to The Information...
Friday 10 April 2026
Anthropic reportedly explores in-house chip design amid rapid revenue growth and evolving AI compute stack
Anthropic is exploring the possibility of designing its own AI chips, though the effort remains at a very early stage, Reuters reported, citing three sources familiar with...
Friday 10 April 2026
AUO eyes CPO and LEO satellites as Innolux pushes FOPLP growth
AUO and Innolux are accelerating their expansion beyond traditional display panels, with Innolux's non-display revenue surpassing 51% in 2025, mainly driven by automotive applications...
Friday 10 April 2026
Transcom Technology sees flat 2026 revenue after Taiwan budget delays, but India order may broaden international reach
Transcom Technology expects flat full-year revenue for 2026 amid stalled progress in Taiwan's defense budget, which is potentially delaying deliveries of Gong-3 and Gong-4 missile...
Thursday 9 April 2026
Haptic touchpads and AI vision chips propel Elan's early 2026 growth

Taiwan-based touch IC design leader Elan Microelectronics announced its March 2026 and first-quarter revenue figures, posting robust growth...

Thursday 9 April 2026
Hinge maker Jarllytec expands into optical communications, targets AI server demand
Jarllytec said operations rebounded in March 2026, driven by shipments of new hinge components for Chinese foldable smartphones. In the near term, shipment peaks for these products,...
Thursday 9 April 2026
Aspeed and ASMedia propelled to top IC design ranks
Although Taiwanese firms have largely missed the core AI chip development battlefield, a few with critical technological barriers have broken through—most notably Aspeed and...
Thursday 9 April 2026
Why global chipmakers want to join TSMC's certified supply chain
TSMC's long-established supplier verification and management system is gradually becoming an industry standard, attracting major players worldwide. Samsung Electronics, Intel, Japan's...
Thursday 9 April 2026
Cyient Semiconductors closes US$85M majority stake in Kinetic Technologies, accelerating India-led power IC scale
India-based Cyient Semiconductors' US$85 million majority investment in Kinetic Technologies could expand end-to-end power semiconductor design and production capabilities from India,...
Thursday 9 April 2026
China accelerates semiconductor equipment localization; Korean firms eyeing Taiwan as orders slip
In response to US semiconductor sanctions and to accelerate AI industry development, China is aggressively promoting localization in semiconductor manufacturing. While South Korean...
Thursday 9 April 2026
Intel–Terafab collaboration highlights potential role for 18A in next-generation AI manufacturing
The collaboration between Intel and Elon Musk under the Terafab initiative is emerging as a potential catalyst for demand for Intel's most advanced manufacturing node, 18A, even as...