Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 8 September 2026

Huawei Kirin 9050 Pro puts LogicFolding to the test with 55% density gain, 66% lower NPU power

Huawei's Kirin 9050 Pro is the first commercial test of its Tau Scaling Law, with the company claiming a 55% increase in transistor density at the same process node while cutting NPU,...

Tuesday 8 September 2026

India's IndieSemiC targets 3 to 5 million Wi-Fi camera modules as local CCTV rules spur demand

Indian chip design company IndieSemiC is targeting shipments of 3 to 5 million locally made Wi-Fi modules in FY27-28, betting that security requirements for CCTV equipment will encourage...

Tuesday 8 September 2026

Black Sesame, Horizon Robotics unveil China's smart driving chip race

China's intelligent driving market continues to surge, with Black Sesame Technologies and Horizon Robotics both reporting solid top-line...

Tuesday 8 September 2026

AI demand gives Aspeed visibility into 2027 as supply constraints ease

Aspeed chairman Chris Lin said the company's order visibility has now extended into 2027, with 2027 backlog already exceeding expected full-year 2026 revenue for the first time. He...

Monday 7 September 2026

How UC Santa Cruz's Silicon Valley lab is reverse-engineering the human brain to solve AI's chip power crisis

As the global race for artificial intelligence (AI) consumes vast oceans of electricity and pushes modern utility grids to the brink, a team of California researchers is looking to...

Monday 7 September 2026

Huawei Kirin 9050 Pro revives flagship chip launches with reported LogicFolding architecture in Mate XT 2

Huawei has unveiled the Kirin 9050 Pro in its new Mate XT 2 tri-fold smartphone, marking the commercial debut of the LogicFolding architecture behind its Tau Scaling Law and Huawei's...

Monday 7 September 2026

DeepSeek plans to buy 160,000 Huawei chips as China aims to wean itself off Nvidia

DeepSeek is reportedly planning to purchase 160,000 Huawei chips for its large 1 GW data center currently under construction in the Chinese province of Inner Mongolia. This would make...

Monday 7 September 2026

Huawei Kirin 2026 challenges 3D chip heat limits with Tau Scaling Law

Huawei is using measured data from its upcoming Kirin 2026 processor to challenge a key concern around vertically stacked logic: that higher transistor density inevitably brings more...

Monday 7 September 2026

Wah Lee sees faster growth in 2027 as supply stays tight

Wah Lee Industrial expects growth to accelerate in 2027 as advanced packaging capacity comes online and foundries continue building overseas fabs, while tight supplies of semiconductor...

Monday 7 September 2026

Every Chinese CPU maker grew in 1H26 but only one grew on processors

Revenue rose at every Chinese chip company examined in the first half of 2026 amid the domestic-substitution push, but the interim filings show three quite different businesses hiding...

Monday 7 September 2026

SiliconAuto pushes AI chiplets as automotive SoC ties tighten

Taiwanese automotive microcontroller (MCU) maker SiliconAuto showcased its products at SEMICON Taiwan 2026, with CEO Gene Liu saying the company is now spotlighting AI chiplet architecture...

Monday 7 September 2026

AI is driving force behind 'Moore's Law on steroids,' says Merck's Benjamin Hein

AI is driving a new wave of technological demand and changing how the semiconductor industry innovates, according to Benjamin Hein, member of the executive board and CEO of the Electronics...

Friday 4 September 2026

From chips to physical AI: Experts urge Taiwan-US push for trusted drone supply chains at Semicon Taiwan 2026

Trustworthy supply chain concerns are extending beyond semiconductors to drones and other autonomous systems, now emerging as national strategic industries. At a Semicon Taiwan 2026...

Friday 4 September 2026

How agentic AI and 'AI physics' are reshaping chip design

As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...

Friday 4 September 2026

China interconnect chipmaker Montage enters Samsung, SK Hynix CXL 3.2 supply chains and begins DDR6 development

Montage Technology is accelerating its move beyond traditional DDR memory interfaces, with CXL 3.2, DDR6 and PCIe products positioning the...

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