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Global supply chain: Key components
Key components news coverage
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Thursday 22 October 2026
Nvidia lines up six suppliers to expand substrate, packaging, and testing capacity
Nvidia said on October 21 that it is working with six supply chain partners to expand manufacturing capacity for substrates, advanced packaging, testing, and optical engines to meet...
Thursday 22 October 2026
Memory surge drives phone makers from LTPO to LTPS
Soaring memory prices are intensifying cost pressure across the display industry, prompting some smartphone manufacturers to downgrade panel specifications. Market estimates indicate...
Thursday 22 October 2026
China's IC designers expand into AI server memory interconnects beyond DDR5
China's IC designers are expanding into high-speed interconnect technologies as AI inference and agent applications fuel demand for server CPUs, memory modules and connectivity chips...
Thursday 22 October 2026
Texas Instruments' analog recovery broadens as 12-inch investment turns into margin
Texas Instruments' third quarter suggested the analog chip upturn has moved beyond restocking into a broad-based recovery, and that the company's multi-year build-out of 12-inch wafer...
Thursday 22 October 2026
Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Wednesday 21 October 2026
Li Auto chip subsidiary Mahe Xin raises CNY1.6 billion in equity financing as automakers aim to become chipmakers
Li Auto's chip and domain controller subsidiary, Mahe Xin Technology, has entered a first-round equity financing agreement worth CNY 1.625 billion (approx. US$243.33 million). The...
Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Wednesday 21 October 2026
AMD and Intel align PyTorch CPU optimizations around oneDNN
AMD and Intel plan to consolidate their PyTorch optimizations for x86 processors in oneDNN, aiming to give AI developers a common path to performance improvements across both companies'...
Wednesday 21 October 2026
PCB material shortages persist as capacity expansion extends beyond 2029
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
Wednesday 21 October 2026
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Wednesday 21 October 2026
Qualcomm plans global performance-based layoffs from November
Qualcomm CEO Cristiano Amon told employees in a memo on October 19 that the company will conduct global, performance-based layoffs after completing its annual employee evaluations,...
Wednesday 21 October 2026
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
The US imposed sanctions on five Chinese entities tied to ex-Google engineer Linwei Ding for theft of trade secrets. The action follows his conviction for stealing confidential AI...
Wednesday 21 October 2026
AMD: Physical AI demands more than TOPS
Physical AI that can sense, reason, control machines and interact with people, Salil Raje, senior vice president of AMD's Embedded Computing Group, said TOPS (trillions of operations...