Global supply chain: Key components

Key components news coverage

IN THE NEWS

Monday 9 February 2026

Taiwan posts fastest growth in 15 years as AI boom drowns out hollowing-out fears

Taiwan's economy expanded 8.63% in 2025, its strongest growth in 15 years, as the island's semiconductor-driven supply chain continued to underpin global demand for AI computing. Minister...

Monday 9 February 2026

India advances semiconductor ambitions as TSMC fabricates DLI-backed startup chips

India marked a milestone in its semiconductor push as seven chip designs from startups under the design-linked incentive (DLI) scheme were successfully fabricated, including advanced...

Sunday 8 February 2026

AMD's investment in photonics and modular architecture signals shift in AI infrastructure development

AMD is positioning itself to address the future needs of artificial intelligence (AI) computing through advances in chip design and system architecture, particularly by integrating...

Sunday 8 February 2026

Record Japan blizzard threatens AI chip supply chains

A record-breaking blizzard driven by extreme weather has battered Japan's northern Aomori Prefecture, dumping snow at more than two and a half times the historical average. The storm...

Sunday 8 February 2026

GlobalFoundries reinvent wafer services by integrating IP to meet evolving market demands

The traditional wafer foundry model is transforming as leading foundries increasingly incorporate intellectual property (IP) into mature technology nodes to address economic pressures...

Friday 6 February 2026

AMD flags 2H26 turning point as MI450 shipments stay on track

AMD's next-generation MI450 AI accelerator remains on schedule for launch and volume production in the second half of 2026, with CEO Lisa...

Friday 6 February 2026

India's 2026–27 budget signals systemic overhaul for manufacturing, semiconductors, and digital investment

India's Union Budget for fiscal year 2026–27, unveiled on February 1, 2026, emphasizes manufacturing, semiconductors, and AI-linked infrastructure as central pillars of economic...

Friday 6 February 2026

ASE expects advanced packaging and testing revenue to double in 2026

OSAT leader ASE Technology Holding is optimistic that its growth momentum will extend through 2026 and beyond, benefiting from the short supply of advanced packaging and testing capacity...

Friday 6 February 2026

CSPs turn to custom silicon to break Nvidia dependence

The global boom in generative artificial intelligence is driving an insatiable demand for computing power. This is pushing the world's largest cloud service providers to rethink a...

Friday 6 February 2026

Qualcomm, MediaTek strike cautious tone as smartphone market pressures mount

Qualcomm and MediaTek struck a similar cautionary tone on the smartphone market outlook during their latest earnings calls, pointing to mounting pressure from memory shortages and...

Friday 6 February 2026

Google doubles AI capex, turning TPU ASIC orders into high-stakes supplier race

Google's latest earnings showed not only solid operating momentum but also an unprecedented surge in capital spending, with capex set to more than double from US$91.45 billion in 2025...

Friday 6 February 2026

Cerebras raises US$1 billion, valuation nearly triples in 6 months

AI chip startup Cerebras Systems has secured a US$1 billion funding round, boosting its valuation to US$23 billion. According to Reuters and Bloomberg, the latest...

Thursday 5 February 2026

Arm pushes compute subsystems as chip design complexity grows

Arm Holdings executives highlighted a growing focus on integrated compute subsystems during the company's latest earnings call, as rising chip design complexity reshapes customer requirements...

Thursday 5 February 2026

Memory shortage weighs on Qualcomm, Arm as smartphone chip sales slow

Arm Holdings reported fiscal third-quarter revenue growth of 26% from a year earlier, supported by gains in licensing and royalties, while...

Thursday 5 February 2026

Skytech delivers self-made PLP equipment, eyes record 2026 growth

As advanced packaging technologies continue to evolve toward larger sizes and panel formats, Skytech CEO George Yi stated that in response to the key process requirements of next-generation...

1/1952 pages