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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 21 October 2026
PCB material shortages persist as capacity expansion extends beyond 2029
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
Wednesday 21 October 2026
Taiwan PCB output set to top NT$1 trillion as VP touts AI opportunity
The 27th Taiwan Printed Circuit Industry International Exhibition (TPCA Show 2026) opened in Nangang on October 20, with Vice President Hsiao Bi-khim calling on the PCB industry to...
Wednesday 21 October 2026
Qualcomm plans global performance-based layoffs from November
Qualcomm CEO Cristiano Amon told employees in a memo on October 19 that the company will conduct global, performance-based layoffs after completing its annual employee evaluations,...
Wednesday 21 October 2026
US sanctions five Chinese entities over trade secret theft tied to ex-Google engineer
The US imposed sanctions on five Chinese entities tied to ex-Google engineer Linwei Ding for theft of trade secrets. The action follows his conviction for stealing confidential AI...
Wednesday 21 October 2026
AMD: Physical AI demands more than TOPS
Physical AI that can sense, reason, control machines and interact with people, Salil Raje, senior vice president of AMD's Embedded Computing Group, said TOPS (trillions of operations...
Wednesday 21 October 2026
DIGITIMES Insights: AI server PCB upgrades drive explosive demand for advanced backdrilling equipment
DIGITIMES observes that as AI servers and high-speed networking equipment continuously pursue higher data transmission rates, printed circuit boards (PCBs) are being upgraded through...
Wednesday 21 October 2026
Zhen Ding Technology showcases AI infrastructure and terminal PCB lineup
PCB manufacturer Zhen Ding Technology (ZDT) Group is exhibiting at TPCA Show 2026 under the theme "One ZDT, Next AI," highlighting its latest technology and R&D achievements in...
Wednesday 21 October 2026
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
Wednesday 21 October 2026
How ByteDance, Alibaba, Tencent are testing the boundaries of US AI chip restrictions
Chinese tech giants ByteDance, Alibaba, and Tencent have collectively ordered more than 3 million units of Nvidia's new RTX PRO 5500 graphics cards, representing a total value exceeding...
Wednesday 21 October 2026
Advanced PCB drilling faces growing demand from AI and high-speed applications
Topoint Technology is positioning its precision PCB drilling business for rising demand from AI servers, high-performance computing, and high-speed transmission applications. At TPCA...
Wednesday 21 October 2026
LX Semicon uses AI agents to cut display chip design time by 80%
South Korean IC design firm LX Semicon has deployed AI agents in the development of display driver ICs (DDIs), reducing the design time for a benchmark image-processing engine from...
Wednesday 21 October 2026
AI customers seek 3-year partnerships as Unimicron calls for Taiwan PCB supply chain collab
TPCA Show Taipei 2026, organized by the Taiwan Printed Circuit Association (TPCA), opened on October 20. Unimicron Technology chairman S.C. Chien delivered a keynote at the opening...
Wednesday 21 October 2026
Nvidia's Vera CPU signals a broader shift in AI infrastructure
Nvidia is positioning its Vera CPU as a central component of data-center infrastructure for agentic artificial intelligence, as multistep reasoning and tool calls increase demand for...
Wednesday 21 October 2026
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...