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Wednesday 2 September 2026
Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates

Interested in knowing how to solve the microcrack problem in through-glass via (TGV) fabrication? Interested in knowing how to supply 1,000 Watts, 1 Volt and 1,000 Amperes...

Wednesday 2 September 2026
Chinese MRAM chipmaker ICY Tech rethinks HBM for rack-scale AI inference
China-based ICY Tech has introduced its uHBM and uLPU AI inference architectures, extending persistent MRAM computing from validation silicon into a product roadmap spanning compute-memory...
Wednesday 2 September 2026
Global quantum industry accelerates as Taiwan eyes Asia hub
As quantum commercialization gathers pace worldwide, Taiwan is linking up with multiple countries to push for an Asia hub for quantum technology, industrial applications, international...
Wednesday 2 September 2026
Plug and Play plans US$100 million Taiwan fund, hopes one of its next five unicorns is Taiwanese
Saeed Amidi has been in Taiwan for about 20 hours, and he has been asking everyone the same question.
Tuesday 1 September 2026
Imec CEO: AI era pushes broader ties between chip, model and CSP players
Imec CEO Patrick Vandenameele said during a media briefing at SEMICON Taiwan 2026 that the Belgian research center is broadening its collaboration base in the AI era, extending beyond...
Tuesday 1 September 2026
ASE CEO describes AI resource squeeze as a short-term problem
AI's early-stage growth is creating a short-term squeeze on land, talent, capital, and power in Taiwan, but there is no such thing as a world that cannot do without Taiwan, ASE Technology...
Tuesday 1 September 2026
Marvell CTO: power and density bottlenecks are driving CPO adoption in AI data centers
Speaking at the Silicon Photonics Global Summit ahead of Semicon Taiwan 2026, Marvell Technology CTO Radha Nagarajan highlighted that the core focus for upgrading connectivity in the...
Tuesday 1 September 2026
Samsung Electro-Mechanics takes glass substrates to Semicon Taiwan
As AI packages grow larger, the next substrate battleground is rapidly extending from traditional organic materials to glass. Samsung Electro-Mechanics (SEMCO) will make its first...
Tuesday 1 September 2026
Anthropic's rumored US$35 billion Lambda deal shows how far Nvidia will go to bankroll its own customers
Anthropic has reportedly signed a cloud-computing contract worth US$35 billion with Lambda, an Nvidia-backed cloud provider, under which Nvidia itself holds the data center lease,...
Tuesday 1 September 2026
XCENA teams up with Samsung on rack-scale CXL memory; demos on Intel Xeon 6
South Korean chip startup XCENA is pushing CXL beyond memory expansion and toward a new layer of server computing, unveiling measured results for its MX1 computational memory device...
Tuesday 1 September 2026
India expands chip ambitions with full Semicon 2.0 notification
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Tuesday 1 September 2026
Semicon Taiwan 2026 to spotlight AI-driven semiconductor supply chain shifts
Semicon Taiwan 2026 is set to open soon as Semiconductor Equipment and Materials International said AI is pushing a new wave of technology upgrades across the global chip industry...
Tuesday 1 September 2026
Nvidia's MediaTek investment signals broader push to shape AI infrastructure
Nvidia's US$3.5 billion investment in MediaTek's overseas convertible bonds marks more than a financial bet. It underscores how the chip leader is trying to anchor its AI infrastructure...
Tuesday 1 September 2026
Nvidia and MediaTek link AI technologies in bid to accelerate custom data center chip adoption
Nvidia and MediaTek are widening a global AI partnership that could reshape data center, edge, and PC hardware markets. MediaTek's US$3.9 billion overseas convertible bond sale, largely...
Tuesday 1 September 2026
Nvidia targets HBM race with custom NVHBM, expands NVLink Fusion
As trillion-parameter large language models (LLMs) and agentic AI become mainstream, the AI infrastructure bottleneck is shifting from raw compute power toward system-level integration...