Global supply chain: Key components

Key components news coverage

IN THE NEWS

Friday 29 August 2025

AEMC, Nanpao, and Trusval form JV targeting high-end semiconductor packaging adhesives

AEMC, Nanpao, and Trusval, on August 28, 2025, announced the establishment of a joint venture (JV) with a capital of NT$500 million (US$16.4 million). The shareholding is divided...

Friday 29 August 2025

VMware remains cautious on expanding support for Arm architecture despite growing market interest

VMware has neither confirmed nor denied rumors suggesting imminent large-scale support for Arm architecture in its cloud computing offerings. While acknowledging customer demand for...

Friday 29 August 2025

India-based boAt, HrdWyr unveil indigenously designed chip with Tata Electronics support

boAt has partnered with semiconductor startup HrdWyr to launch the HrdWyr Indus 1011, a high-volume chip fully designed in India, with assembly, packaging, and testing enabled by...

Friday 29 August 2025

Commentary: Cambricon soars on Nvidia’s China absence, but bubble risks loom

Nvidia projected third-quarter fiscal 2026 revenue of about US$54 billion, beating market consensus but trailing the most optimistic forecasts of US$60 billion. Crucially, the outlook...

Friday 29 August 2025

AI demand and state backing lift China's semiconductor rally

Shares of Chinese semiconductor firms rallied after a wave of strong half-year earnings, highlighting how Beijing's AI push is reshaping...

Friday 29 August 2025

Samsung reportedly explores BOE's WOLED panels for its gaming monitors

BOE Technology is reportedly in talks with Samsung Electronics and other manufacturers to supply white OLED (WOLED) panels for monitors,...

Friday 29 August 2025

Nvidia and Google cash in on AI inference as AMD racks up losses

Global technology giants are racing to expand AI inference capacity, and Morgan Stanley says the economics are proving extraordinary. A new report from the bank, based on detailed...

Thursday 28 August 2025

US weighs equity stakes in chipmakers under CHIPS Act, but Nvidia off the table

The Trump administration's move to take a 10% stake in Intel has intensified debate over whether CHIPS and Science Act subsidies could be linked to equity ownership, fueling concerns...

Thursday 28 August 2025

Silicon Motion accelerates PCIe Gen5 production as Windows 10 retirement fuels PC upgrade surge

PC demand remains soft under macroeconomic pressures, but the phase-out of Windows 10 is expected to drive an upgrade cycle that will accelerate PCIe Gen5 adoption. NAND flash controller...

Thursday 28 August 2025

CoWoP packaging takes on TSMC’s CoWoS, pressures CoPoS in AI chips

Advanced packaging technologies are evolving at breakneck speed, with attention now shifting beyond wafer-level processes to panel and printed circuit board (PCB) platforms. A new...

Thursday 28 August 2025

Youngwoo DSP secures display equipment contract with Samsung Display Vietnam

South Korean display inspection equipment company Youngwoo DSP has signed a supply contract with Samsung Display Vietnam (SDV) valued at KRW17.9 billion (approx. US$13.2 million)...

Thursday 28 August 2025

Nvidia warns on China H20 sales, clarifies Singapore billing

Nvidia faces uncertainty over H20 chip shipments to China despite strong second-quarter results

Thursday 28 August 2025

Nvidia ramps GB300, RTX PRO, and Rubin platforms as AI infrastructure demand soars

Nvidia posted US$46.7 billion in revenue for the second quarter, up 56% year-on-year, driven by strong AI and data center demand. Looking ahead, the company is ramping GB300 racks,...

Thursday 28 August 2025

Nvidia Q2 revenue surges 56%, excludes China H20 sales from 3Q outlook

Nvidia posted second-quarter of fiscal 2026 revenue of US$46.74 billion, up 56% from a year earlier, fueled by demand for its AI chips and data center products. The company expects...

Thursday 28 August 2025

South Korea races to close gap in hybrid bonding as global rivals move ahead

South Korean experts are raising alarms that domestic semiconductor equipment manufacturers may be falling behind in developing hybrid bonding technology—critical for advancing...

2/1883 pages