Google's expanding list of TPU partners has sparked widespread industry discussion, centering on whether current IC design suppliers Broadcom and MediaTek will see their orders imp...

India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT...

BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...

Nvidia has introduced Jetson Orin Nano 2, a compact robotics computer aimed at entry-level edge AI, with implications for developers building autonomous machines worldwide. The system...

OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...

Xiaomi officially unveiled its next-generation in-house system-on-chip (SoC), the Xring O3, at its Xring Chip Technology Briefing on August 24, continuing to position the silicon as...

Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...

The global small-size OLED market was flat in the second quarter of 2026 as seasonal weakness and cautious inventory management by Chinese device makers slowed demand. Samsung Display,...

As robotaxi services expand beyond individual cities into wider regions, the growing appeal of AI-assisted driving and the technological vision that AV developers are eager to realize...

Samsung Electronics commercialized fan-out panel-level packaging (FOPLP) before rivals, using the technology in mobile and wearable chips and now preparing to extend it into AI and...

Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...

Nexperia China said it has rebuilt a domestic 12-inch wafer supply chain after 330 days of overseas wafer supply disruptions, unveiling the new platform at a press conference outlining...

Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...

Global demand for AI and high-performance computing (HPC) has lifted investment returns for Taiwan-listed companies in China, with Foxconn continuing to lead the pack. According to...

As Nvidia's next-generation Vera Rubin platform enters deployment, Taiwan's server supply chain is finding ways to bridge the transition gap before ramping up volume production. Ongoing...