Global supply chain: Key components

Key components news coverage

IN THE NEWS

Tuesday 25 August 2026

Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects

Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...

Tuesday 25 August 2026

Novosense encoder launch highlights China's push into robot joint sensing

Chinese analog and mixed-signal chipmaker Novosense Microelectronics has introduced the NSM350x series, a Hall-based magnetic encoder designed for high-precision angular measurement...

Tuesday 25 August 2026

Infineon buys India-based C2i Semiconductors to bolster AI data center power systems

Infineon Technologies has agreed to acquire Bangalore-based C2i Semiconductors, a move that strengthens its position in power delivery for AI data centers and highlights India's growing...

Tuesday 25 August 2026

Nvidia Groq 3 LPX enters full production for faster agentic AI inference

Nvidia said its Groq 3 LPX inference accelerator is now in full production, a move that could speed up agentic AI systems used worldwide...

Tuesday 25 August 2026

SpaceXAI to use Nvidia Vera CPUs for faster agentic AI at scale

SpaceXAI plans to deploy Nvidia's new Vera CPUs to speed up agentic AI workloads, a move that could influence how advanced AI systems...

Tuesday 25 August 2026

IBM unveils dual-architecture mainframe chip to run Arm, z/OS, Linux workloads

In an August 24 press release, IBM announced that it is developing the first dual-architecture mainframe processor, a move that could...

Tuesday 25 August 2026

Broadcom's debt push signals AI compute is becoming Wall Street asset class

The AI infrastructure race is entering a phase where access to silicon is no longer the only constraint. As compute demand expands into multi-gigawatt projects, the industry is increasingly...

Tuesday 25 August 2026

SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip

The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...

Monday 24 August 2026

Xiaomi taps TSMC to make chips for foldables, AI and autonomous driving

Xiaomi is expanding its in-house semiconductor push from smartphones into AI acceleration and autonomous driving, unveiling three Xring processors that deepen its reliance on TSMC...

Monday 24 August 2026

Advanced packaging substrates hit limits; ceramic cores rise to challenge glass materials

As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, advanced packaging substrates face mounting challenges: larger...

Monday 24 August 2026

Nvidia's strikes US$6B licensing deal with Poolside to accelerate Nemotron models

Nvidia reportedly struck a US$6 billion deal with startup Poolside to license its technology and hire much of its staff. The technology and personnel will reportedly support the chipmaker's...

Monday 24 August 2026

Taiwan semiconductor materials hit golden opportunity

Rising concerns over potential supply chain chokepoints for critical raw materials have driven the formation of the SEMI Taiwan Materials Alliance. Wei-Wang Chen, General Manager of...

Monday 24 August 2026

MediaTek, GUC, Alchip escalate funding war as global ASIC race demands deep capital

Custom Application-Specific Integrated Circuit (ASIC) chips backed by hyperscalers are set for a mass-production boom starting late 2026, with next-generation projects already in full...

Monday 24 August 2026

AI chip roadmaps force faster changes in data-center design, Cadence says

Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...

Monday 24 August 2026

ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

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