Global supply chain: Key components

Key components news coverage

IN THE NEWS

Wednesday 28 May 2025

Google’s AI reset: I/O 2025 marks a turning point

Following years of trailing its competitors and facing mounting skepticism, Google appeared to turn a corner at this year's I/O developer...

Tuesday 27 May 2025

China chip industry rises under US sanctions, Taiwan suppliers pivot

While the US-China trade war has entered a tentative truce, tensions in the semiconductor sector are escalating, placing renewed scrutiny on Taiwan's IC substrate manufacturers operating...

Tuesday 27 May 2025

Samsung's impossible choice: absorb 25% tariff hit or price out US customers

US President Donald Trump's announced 25% tariff on smartphones manufactured outside the US has once again ruffled the feathers of markets, especially for Apple and Samsung Electronics,...

Tuesday 27 May 2025

FOCI advances 1.6T optical module validation as LPO and CPO poised to coexist

As data transmission and exchange volumes skyrocket, high-speed connectivity has emerged as a defining trend in the tech landscape. FOCI Fiber Optic Communications, a leading player...

Tuesday 27 May 2025

Malaysia bets on advanced chip design to power US$270 billion semiconductor ambition

Southeast Asian nation pivots from assembly hub to IC design powerhouse amid global supply chain tensions, but faces talent and scaling challenges

Tuesday 27 May 2025

AI chips and CoWoS orders keep HPI’s outlook running hot

Hon. Precision (HPI), a leading IC test equipment manufacturer, is benefiting from robust AI chip demand. In the first quarter of 2025, its after-tax net profit surged to NT$2.568...

Monday 26 May 2025

AI gives small chipmakers a shot at the big leagues

Taiwanese IC design companies made a strong showing at Computex 2025, using the global stage to spotlight cutting-edge technologies developed for AI applications. While tech giants...

Monday 26 May 2025

Hygon, Sugon unify to cement China's HPC leadership

China's Dawning Information Industry Company (Sugon) and Hygon Information Technology announced plans for a strategic merger on May 25 to consolidate the country's computing power...

Monday 26 May 2025

Xiaomi takes the long road on custom chips as Qualcomm shrugs off the XRing O1

Xiaomi has unveiled its new in-house smartphone processor, the XRing O1, positioning it as a direct competitor to flagship system-on-chips from Qualcomm and MediaTek. Designed with...

Monday 26 May 2025

Malaysia's neutrality tested: Huawei AI project draws G2 heat

Malaysia is walking a diplomatic tightrope as a locally initiated artificial intelligence project involving Chinese tech giant Huawei has drawn scrutiny from both the US and China,...

Monday 26 May 2025

Taiwan's President Lai calls for resilient chip alliances to counter dumping and fortify innovation

Taiwan's President Ching-te Lai, speaking at the Global Semiconductor Supply Chain Partnership Forum held in Taipei on May 23, warned that the semiconductor industry is facing increasing...

Monday 26 May 2025

Innatera's Pulsar: first neuromorphic RISC-V MCU, TSMC-fabbed for edge AI era

Innatera, a Dutch semiconductor company, has unveiled Pulsar—the world's first mass-market neuromorphic microcontroller tailored...

Monday 26 May 2025

Nvidia reportedly develops new lower-cost AI chip for China to skirt US export curbs

Nvidia is reportedly developing another lower-cost AI chip for China, pricing it at US$6,500–8,000—well below its restricted H20 model. The new GPU, based on Blackwell...

Monday 26 May 2025

Weekly news roundup: Huawei's 5G lead, DeepSeek's LLM moves, and TSMC's packaging gap

These are the most-read DIGITIMES Asia stories from the week of May 19 – May 25. Highlights include China's accelerating push for tech self-sufficiency with new AI...

Monday 26 May 2025

Xiaomi enters 3nm race, but Lei Jun says it's no Apple showdown

Xiaomi has launched its first self-designed 3nm system-on-chip, the XRing O1, positioning it as the cornerstone of a broader push into advanced semiconductors. Debuting inside both...

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