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Global supply chain: Key components
Key components news coverage
IN THE NEWS
Wednesday 25 October 2023
Micron collaborates with Qualcomm to accelerate generative AI
Micron Technology has announced that production samples of its low-power double data rate 5X (LPDDR5X) memory, which the company claims is the industry's only 1-beta mobile-optimized...
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Wednesday 25 October 2023
AI to boost terminal device replacement
AI will drive demand for PC, handset, and other terminal device replacements, according to sources at chipmakers.
Wednesday 25 October 2023
Positive prospects for automotive and AI server opportunities, Taiwan's PCB industry continues the ride on momentum of innovation
Looking at the overall condition of the Printed Circuit Board (PCB) market in 2023, efforts to reallocate and adjust the electronics supply chain are palpable amidst the decline in...
Wednesday 25 October 2023
For LCY, modest expectations for PCB market in 2024
At the October 24 earnings call for PCB upstream copper foil supplier LCY Technology, an affiliate of the LCY Group, vice president Li Yu-min pointed to a cautious outlook for the...
Wednesday 25 October 2023
Tech industry layoffs continue
Uncertain demand recovery, along with the escalating trade dispute between China and the US, has resulted in a deluge of layoffs that shows no signs of letting up, according to industry...
Wednesday 25 October 2023
Car applications become AUO's third-largest product line and the firm's big-name partners unveiled
AU Optronics (AUO) has been actively positioning itself in the automotive market as automotive applications becoming the third largest product line at AUO, surpassing LCD monitors...
Tuesday 24 October 2023
Embracing sustainability and smart manufacturing in the PCB Industry: insights from the 2023 TPCA Show
The 2023 TPCA Show, hosted by the Taiwan Printed Circuit Board Association (TPCA), convened over 450 global PCB brands and featured 1,376 booths representing participants from Europe,...
Tuesday 24 October 2023
Foxconn seen not to easily reduce presence in China after tax probe
Foxconn Technology Group will not easily scale down its business deployments in China though it has come under tax probes and land use investigations by the Chinese authorities, and...
Tuesday 24 October 2023
Nvidia to challenge Intel with Arm-based processors for PCs
Nvidia Corp. is using Arm Holdings Plc technology to develop chips that would challenge Intel Corp. processors in personal computers, ratcheting up competition between the two semiconductor...
Tuesday 24 October 2023
Taiwan-based Neuchips targets AI inference chip market with energy-efficient solutions
Ken Lau, CEO of Neuchips, shared his views on the AI chip sector in a recent interview with DIGITIMES. He said while Nvidia seems to be the main supplier of general-purpose GPUs,...
Tuesday 24 October 2023
Japan seeks to build common standards on semiconductor and EV subsidies with the US and Europe
The Japanese government is currently attempting to collaborate with the United States and Europe to establish common standards for subsidies in the semiconductor and electric vehicle...
Tuesday 24 October 2023
South Korean semiconductor and display equipment face rising inventory
With demand in the global ICT market stagnating, South Korea's semiconductor and display equipment inventory has seen a 285.3% YoY increase in August 2023. On top of that, this has...
Tuesday 24 October 2023
Intel CEO to attend company forum in Taiwan
Following Nvidia CEO Jensen Huang's recent visit to Taiwan, Intel CEO Pat Gelsinger will visit the country for the second time in six months, according to sources familiar with the...
Tuesday 24 October 2023
Ansys semiconductor simulation tools certified for UMC WoW advanced packaging
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...