Amid increased US restrictions on chip exports, major players like Nvidia and Intel are navigating challenges by offering lower-spec products to maintain their dominance in China.

These are the most-read stories during the week of November 6-10:

Taiwan Semiconductor Manufacturing Company (TSMC) reported robust performance for its October revenue, totaling NT$243.23 billion (US$7.52 billion), up 34.8% from September, thanks...

In the revised budget for the fiscal year 2023 (April 2023 to March 2024) proposed by the Japanese Ministry of Economy, Trade, and Industry (METI), approximately US$13 billion (JPY2...

At the venue where Taiwan Semiconductor Manufacturing Company (TSMC) founder Morris Chang received the honor of the inaugural Li Kuo-Ting Award in Taipei on November 9, Nvidia founder...

Collaboration between TSMC and Sony enables Japan to pursue cutting-edge technology on a global scale, according to Akira Amari, Japan's former trade minister and current member of...

TSMC will soon announce a plan to build its second wafer fab in Japan, according to industry sources. The fab will be involved in 6nm process manufacturing, and the Japanese government...

MediaTek has announced the Dimensity 9300 - a new flagship mobile chip featuring a one-of-a-kind "all big core" design.

Major Taiwanese semiconductor firms, such as TSMC and ASE Technology, have been working on silicon photonics (SiPh), which could propel Taiwan to the forefront of the sector.

The global tech landscape has been turbulent in 2023, with many companies experiencing significant profit fluctuations and some even plunging into losses. However, the semiconductor...

These are the most-read articles during the week of October 30-November 3:

In a significant development for the 10-year Taiwan Chip-Driven Industrial Innovation Program (TCIIP), certain businesses have expressed their willingness to donate 12-inch wafer...

In light of Taiwan Semiconductor Manufacturing Company's (TSMC) decision to suspend its plans for a new fabrication facility in the Longtan section of Hsinchu Science Park (HSP) due...

TSMC has made changes to its new fab projects in Taiwan, including the suspension of a planned advanced packaging fab in the Hsinchu Science Park (HSP) Tongluo site, according to...

With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.