These are the most-read news stories in the week of August 28–Sept 1, 2023 on DIGITIMES Asia website:

The ongoing AI boom benefits not only software developers but also industrial design and simulation software vendors, with Taiwan Auto Design Co. (TADC), a veteran distributor of...

3D IC technology has emerged as a significant advancement in the semiconductor industry. Despite its significance, there are still a number of unresolved issues and challenges that...

TSMC has encountered difficulties building its advanced wafer fab in the US, sparking concerns over the prospects of the Taiwanese foundry house's overseas expansions in terms of...

Wistron has secured significant GPU substrate orders for AI servers and anticipates its server product shipments will increase month by month for the remainder of this year, according...

Wet process equipment specialist Grand Process Technology (GPTC), reportedly among TSMC's suppliers, is optimistic about its operations in the second half of this year.

Intel may overtake Samsung Electronics as the world's second largest contract chipmaker as early as 2024, trailing only TSMC, according to industry sources.

TSMC is unlikely to see a significant increase in 3nm chip orders until 2024, according to industry sources.

The German Trade Office Taipei has released its latest Corporate Social Responsibility (CSR) report on August 28. During the publication press conference for the CSR report, the trade...

Samsung Electronics, having obtained its first customer for its Taylor, Texas fab, is expected to increase its business in semiconductor foundry services. However, the competition...

TSMC's wafer fab under construction in Kumamoto aligns with the purpose of the Economic Security Promotion Act (ESPA) legislated by the Japanese government in 2022, which highlights...

High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...

Recent statements by TSMC and Intel regarding their ambitious capital expenditure plans for advanced packaging have raised the bar for incumbent competitors and new entrants alike,...

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...