System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,...

While the Intel-initiated Universal Chiplet Interconnect Express (UCIe) consortium has attracted many participants, Japan's academic and industry players are also stepping up efforts...

ASML reportedly has seen the first cutback in orders for EUV equipment from TSMC, its largest customer, which market insiders speculate is on track to slash such orders by over 40%...

With TSMC also reportedly to slow down capacity expansions in Taiwan, IC design houses will find it even more difficult to expect a downturn in their chips foundry costs, according...

The vast stretch of land lying a kilometer north of the German city of Grossenhain, Saxony has long been a part of the country's military history: at the onset of World War 1, the...

Both Samsung Electronics and Intel are having difficulty obtaining orders for 3nm as well as sub-3nm chips, while TSMC continues to grow its client base in the process segment, according...

TSMC has revised the company's blueprint for capacity expansion, reducing its scale and slowing down its pace. However, the pure-play foundry is still evaluating the feasibility of...

Automotive supply chain players are skeptical if TSMC, Intel and Samsung's pursuit of advanced process technologies and capacity expansions will bring real benefits in the long run...

TSMC reportedly has decided to build a fab in Germany jointly with local partners in a collaboration model similar to that for its ongoing fab project in Japan, according to industry...

TSMC may adjust its capex target for 2023 downward, currently set at US$32-36 billion, according to industry sources.

Sources familiar with TSMC's plan in Germany indicated to DIGITIMES Asia that TSMC will reach a decision in summer regarding the construction of its German fab.

TSMC is slowing down its pace of capacity expansions in Taiwan, as its first-quarter 2023 sales missed guidance, according to industry sources.

Samsung Electronics's DS (Device Solutions) division is rumored to be officially introducing fan-out wafer-level packaging (FOWLP) into mass production starting in the fourth quarter...

Terminal brand vendors of PCs, smartphones and home appliances are accelerating their inventory depletion, with PC inventory showing the fastest destocking pace, which indicates that...

Sharp increases in global demand for advanced and mature chip manufacturing processes continued to significantly bolster equipment purchases by TSMC and other Taiwanese foundry peers...