TSMC has grabbed orders for Nvidia's next-generation AI processor called B100, which requires the foundry's 3nm process fabrication, according to industry sources.

Mitsubishi Chemical Group is planning to build a factory for the production of Argon Fluoride (ArF) photoresist materials required for semiconductor manufacturing. The proposed location...

TSMC's construction of a new wafer fab in Kumamoto Prefecture, Kyushu, Japan, has revitalized the once-declining "Kyushu Silicon Island" concept, but water and renewable energy infrastructure...

The performance of the new A17 Pro chip used in the latest iPhone 15 Pro series will determine the potential success of 3nm SoCs, which may be critical in propelling the mobile phone...

With Intel splitting its manufacturing and design divisions, competitors such as AMD and Nvidia are already considered as potential Intel customers, said Intel CEO Pat Gelsinger during...

A Taiwan-US supply chain partnership forum held in Taipei alongside the US Business Day on September 19 saw delegations of government and corporate representatives from both sides...

Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) signed an agreement with the Saxon Science Liaison Office Taiwan and TU Dresden on September 19 in Taipei to address the semiconductor...

Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...

The German state of Saxony and Taiwan Semiconductor Manufacturing Co. are working together on an exchange program that will bring Dresden students to Taiwan for internships in a push...

Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the chipmaker's plants in the state, Governor Katie Hobbs...

Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...

Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...

Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.

With SoftBank-backed IP giant Arm launching a blockbuster IPO (initial public offering) on the US Nasdaq market on September 14 at a unit share price of US$51, its CEO Rene Haas bears...

After the reconfiguration of global supply chains, it will mark the beginning of Taiwan's great navigation era, and the trend of large-scale supply chain relocation has made supply...