China's leading semiconductor equipment maker Advanced Micro-fabrication Equipment (AMEC) recently has announced its winning a final court judgment in Shanghai in a lawsuit involving...

Despite significant sales shrinkages amid lingering economic downturns and market headwinds, there have been no significant layoffs among nearly all the upstream and downstream players...

The continuous expansion of TSMC's fab in Taiwan, home to the world's largest pure-play foundry, is essential for preserving the country's supply chain advantages, according to industry...

Intel unveiled its Gaudi 2 China Special Edition deep learning processor in Beijing on July 11 and received almost unanimous praise from Chinese media outlets. In addition to mentioning...

Japanese media Nikkan Kogyo reported that TSMC has drawn up a plan to start construction of a second wafer fab in Kumamoto Prefecture, Japan, from April 2024 onwards. The location...

Foxconn Technology (Hon Hai Precision Technology) has announced that the joint ventures it set up with the Vedanta Group in India would become wholly owned by Vedanta, with Foxconn...

Due to ongoing order adjustments from multiple clients, including MediaTek, TSMC's revenue in June 2023 was NT$1564.04 billion (approx. US$49.82 billion), a decrease of 11.4% compared...

Taiwan's annual semiconductor output value is projected to surpass NT$6 trillion (US$191.45 billion) by 2030 from NT$4.2 trillion estimated for 2023 for a double-digit CAGR during...

IC analysis and inspection lab Material Science Service (MSScorps) witnessed a double-digit sequential revenue spike in the second quarter, with revenue for the first half of 2023...

Despite intensifying tension between the US and China that may lead to more restrictions on AI GPUs against China, China-based AI chip design houses are expanding their chip orders...

Google was scheduled to launch the first fully customized Tensor chip for its Pixel smartphones in 2024, but it has reportedly postponed the plan to 2025 and is said to be planning...

One of AMD CEO Lisa Su's priorities for her planned mid-July visit to Taiwan will be securing TSMC's available CoWoS packaging capacity, according to sources with knowledge of the...

Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...

At the 27th Automotive Electronics Congress in Ludwigsburg, Germany, Paul de Bot, General Manager of TSMC Europe, shared how the world's most advanced foundry views the automotive...

Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...