Automotive supply chain players are skeptical if TSMC, Intel and Samsung's pursuit of advanced process technologies and capacity expansions will bring real benefits in the long run...

TSMC reportedly has decided to build a fab in Germany jointly with local partners in a collaboration model similar to that for its ongoing fab project in Japan, according to industry...

TSMC may adjust its capex target for 2023 downward, currently set at US$32-36 billion, according to industry sources.

Sources familiar with TSMC's plan in Germany indicated to DIGITIMES Asia that TSMC will reach a decision in summer regarding the construction of its German fab.

TSMC is slowing down its pace of capacity expansions in Taiwan, as its first-quarter 2023 sales missed guidance, according to industry sources.

Samsung Electronics's DS (Device Solutions) division is rumored to be officially introducing fan-out wafer-level packaging (FOWLP) into mass production starting in the fourth quarter...

Terminal brand vendors of PCs, smartphones and home appliances are accelerating their inventory depletion, with PC inventory showing the fastest destocking pace, which indicates that...

Sharp increases in global demand for advanced and mature chip manufacturing processes continued to significantly bolster equipment purchases by TSMC and other Taiwanese foundry peers...

Both TSMC and United Microelectronics (UMC) missed first-quarter revenue targets set in January.

Update: Market upservers and TSMC both attribute the company's lower-than-expected first-quarter revenue to currency exchange fluctuations. TSMC's revenue in US dollar terms actually...

With TSMC customers cutting back on orders or delaying shipment pull-in in the first quarter of 2023, market doubts are emerging about whether the foundry's overall business operations...

TSMC revenue for March 2023 fell over 10% on both sequential and on-year bases, according to the company's latest report.

Fab toolmaker Marketech International expects to generate flat or slight revenue growth this year, judging from the NT$60 billion (US$1.97 billion) worth of orders it has on hand.

Nvidia is expected to use TSMC's 3D SoIC (system on integrated chips) stacking and chiplet packaging technology in its high-end processors set to debut between 2024 and 2025, according...

Water and electricity shortages are more difficult to manage than rising manufacturing costs, according to sources in Taiwan's IC manufacturing sector.