With TSMC ramping up its sub-5nm process and advanced packaging manufacturing capacities, Grand Process Technology (GPTC) and Kinik are both seen the visibility of orders from the...

TSMC has seen its major clients including AMD, Apple, Broadcom, Intel, MediaTek, Nvidia and Qualcomm queue up for 3nm process capacity, according to sources at fab toolmakers.

Samsung has announced plans to commit a KRW450 trillion (US$346.5 billion) investment over the next five years, with over 60% of the new funds to enhance the capability and competitiveness...

Eyeing promising long-term demand, silicon wafer supplier GlobalWafers is on track to carry out its capacity expansion plans, according to company chairperson Doris Hsu.

TSMC and other major Taiwan-based foundries have been running their fabs at full capacity utilization, but may see their fab utilization rates drop in the third quarter due to cutbacks...

Leading CPU and GPU vendors AMD and Nvidia are all set to commercialize brand-new CPU and GPU platforms in 2023, and their backend partners in Taiwan are all gearing up to give full...

Samsung Electronics vice chairman Jay Y Lee's recent visits to both ASML in the Netherlands and Imec in Belgium have had industry observers believe that the Korea-based vendor is...

TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...

As battery demand for energy storage and electric vehicles (EV) rises in the US, lithium battery makers with foreign investment in the country could face similar challenges that TSMC...

As global warming receives global attention, curbing greenhouse gas is both a responsibility and pressue for companies. This pressure, which promises to gradually become cost and...

The world's three leading game console vendors Sony, Nintendo and Microsoft have shown mixed sales results amid the supply crunch of some basic chips and components.

TSMC is tightening up its payment terms for better cash flow and greater stability, according to industry sources.

Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.

Texas Instruments (TI) has notified its clients that the supply-demand imbalance for analog chips, particularly power management ICs (PMICs), will ease in the second half of the year,...

US memory vendor Micron Technology is set to move its 1-gamma EUV process technology to volume production at its new fab, A3, in central Taiwan in 2024, and will install the first...