TSMC's still-tight fab capacity may encourage the foundry to raise its foundry quotes in June, with fellow Taiwan-based foundries likely to follow suit making another upward adjustment...

Despite commitments from companies such as Foxconn to set up fabs, the Indian government is still wooing Intel and TSMC to establish a local fab.

Taiwan-based pure-play foundries continue to see orders for automotive semiconductors ramp up while stepping up their capacity expansion pace, according to industry sources.

With advanced 2.5D and 3D IC packaging technologies requiring a considerable amount of capex for R&D and manufacturing capabilities, there will be just a few players engaged in...

TSMC is estimated to rake in revenues of NT$500 billion (US$17.024 billion) from fulfilling Apple orders in 2022, up from NT$405.4 billion in 2021, with the US tech giant expected...

IC wafer capacity is forecast to grow 8.7% in 2022 after rising 8.5% in 2021, thanks to the addition of 10 new 300mm fabs that are scheduled to open this year, according to IC Insi...

As Tesla aims to produce 1.5 million electric vehicles in 2022, hiking 60% on year, its demand for highly customized Si-based IGBT modules and SiC-based power modules supplied by...

TSMC has set a timetable to move its 2nm GAA process to production in 2025 while commercializing its 3nm FinFET process with improved yield rates in the second half of 2022, with...

TSMC founder Morris Chang again made the headlines by giving frank opinions on the semiconductor policy of the United States. But shrewd readers should definitely read between the...

Poor 3nm GAA process yield performance is deemed as a major setback for Samsung Electronics in its advanced foundry technology race with TSMC, which may dash the Korean tech giant's...

Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...

Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...

Delivery lead times for semiconductor equipment have extended to more than 18 months from six months in the middle of 2021, according to industry sources.

OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...

Intel reportedly is mulling expanding its outsourced backend operations to include PC-use chipsets, and Powertech Technology (PTI) is expected to become the first Taiwan-based OSAT...