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TSMC updates
Foundry house TSMC plays a crucial role in the semiconductor sector, and the world economy in general.
IN THE NEWS
Thursday 10 June 2021
IC analyzers sees booming demand for advanced foundry, packaging
Taiwan-based specialists in semiconductor materials analysis, IC test and verification services will see their sales for the second half of the year driven by continuous R&D on...
Wednesday 9 June 2021
Tight foundry capacity to persist throughout 2021
Taiwan-based pure-play foundries continue to see customers pull in orders despite concerns about overbooking, and will see their fab capacity stay extremely tight throughout 2021,...
Tuesday 8 June 2021
Foxsemicon sees COVID cluster infections
Semiconductor equipment maker Foxsemicon Integrated Technology, an affiliate of the Foxconn Technology Group, has announced suspension of its fab operations in Taiwan for two days...
Tuesday 8 June 2021
GUC tapes out AI/HPC/networking platform on TSMC CoWoS technology
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out AI/HPC/Networking CoWoS Platform with 7.2 Gbps HBM3 Controller and PHY, GLink-2.5D...
Friday 4 June 2021
TSMC InFO_B packaging gains positive feedback
TSMC's just-unveiled InFO_B packaging technology designed for smartphones enables DRAM stacking flexibility at contract manufacturers, and has received positive feedback from handset...
Friday 4 June 2021
Taiwan IC design houses poised to enjoy strong 2Q21
Rising foundry and backend manufacturing costs have prompted Taiwan's IC design houses to raise their chip prices, which will buoy their sales performance in the second quarter of...
Friday 4 June 2021
Rapid COVID testing site set up in Taiwan HSP
A site for COVID-19 rapid testing has been set up at Taiwan's Hsinchu Science Park (HSP) to provide one-stop services from rapid screening for diagnosing COVID-19, highly specific...
Thursday 3 June 2021
Highlights of the day: TSMC fast expanding capacity
TSMC is gearing up expansion of its capacity in response to strong demand from diverse sectors. According to the foundry's CEO, TSMC...
Thursday 3 June 2021
TSMC stepping up advanced process capacity expansion
TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.
Thursday 3 June 2021
New NXP automotive processors built using TSMC 16nm FinFET process
NXP Semiconductors and TSMC have jointly announced volume production of NXP's S32G2 vehicle network processors and S32R294 radar processor built using TSMC's 16nm FinFET process technology...
Wednesday 2 June 2021
AiP, 3D IC packaging increasingly adopted for 5G mmWave, HPC chips
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Wednesday 2 June 2021
TSMC unveils N6RF, N5A and new 3DFabric technologies
TSMC at its ongoing technology symposium held online has unveiled its latest innovations in advanced logic technology, specialty technologies, and the additions of its 3DFabric advanced...
Wednesday 2 June 2021
AMD presents 3D chipset developed jointly with TSMC
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Monday 31 May 2021
NXP is yet another vendor striking long-term deal with UMC
NXP Semiconductors is another chip vendor which has struck a long-term deal with United Microelectronics (UMC) under which the pure-play foundry will have some of its newly-established...
Thursday 27 May 2021
TSMC ramping up output for automotive MCUs
TSMC has disclosed it is ramping up its output for automotive microcontrollers (MCU) for 2021, which will be 60% higher than in 2020.