TSMC founder Morris Chang again made the headlines by giving frank opinions on the semiconductor policy of the United States. But shrewd readers should definitely read between the...

Poor 3nm GAA process yield performance is deemed as a major setback for Samsung Electronics in its advanced foundry technology race with TSMC, which may dash the Korean tech giant's...

Apple has become a bellwether in the HPC chip segment by rolling out its high-performance M1 series built using advanced process at its foundry partner, but all other manufacturing...

Apple will no longer be the exclusive customer of TSMC adopting the foundry's advanced integrated fan-out (InFO) wafer-level packaging, which is expected to attract orders for Android...

Delivery lead times for semiconductor equipment have extended to more than 18 months from six months in the middle of 2021, according to industry sources.

OSAT ASE Technology with its fan-out chip on substrate (FOCoS) packaging technology is gearing up for a boom in HPC chip demand, eyeing orders from major processor vendors including...

Intel reportedly is mulling expanding its outsourced backend operations to include PC-use chipsets, and Powertech Technology (PTI) is expected to become the first Taiwan-based OSAT...

TSMC is expected to see revenue generated from the HPC sector contribute more than NT$700 billion (US$23.9 billion) to the pure-play foundry's total revenue this year, according to...

Samsung Electronics' 3nm GAA process yield rates reportedly are still far behind the chip vendor's target.

TSMC does not comment on its pricing details, but has no plans to drop its prices even in a downturn, said company CEO CC Wei during a Q&A session of the company's recent earnings...

Taiwan's IC designers are likely to see their profit momentum constrained by the double pressures of persisting high foundry costs and growing price reduction calls from downstream...

TSMC is on track to move 3nm process technology to volume production in the second half of this year, according to company CEO CC Wei, who also reiterated the foundry's plans to launch...

Oppo is reportedly working on an in-house application processor (AP) to power its future smartphones, and the chipset is expected to enter volume production in 2023.

Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...

TSMC expects to post revenues of between US$17.6 billion and US$18.2 billion in the second quarter of 2022, which is a 1.9% sequential increase at the midpoint. Gross margin and operating...