Around the web
7 Sep 20094 Sep 20093 Sep 2009
Despite its increased cost cutting course, Infineon plans no further job cuts.
EETimesUK
IT Pro Portal
Elpida Memory said it has developed a copper through-silicon via technology (Cu-TSV) and applied it to an 8Gb DRAM with vertical connections among eight memory die and an interface chip.
Semiconductor International
Japan's Sumco, the world's No.2 maker of silicon wafers used to make chips, said it tumbled to a first-half loss on weaker wafer demand from chipmakers.
Reuters
Word on the street is that Micron is seeking to enter the NOR flash market. Some also speculated that Intel wants to unload its interest in Numonyx.
EE Times
Shares of memory chip developer Rambus rose 8% on September 4 on speculation that Samsung Electronics would buy the company, but Samsung said it had no such plans.
Reuters (via Forbes.com)
Because "LED TV" implies that displays are comprised totally of LEDs, which is not the case, the Advertising Standards Authority wants Samsung to change its ads in the UK.
LEDs Magazine
OLED-info.com
OLED-info.com
OLED-info.com
LG Electronics, the world's second-biggest maker of LCD televisions, said the company aims to increase shipments by about 47 percent next year, driven by demand from emerging markets.
Bloomberg
Cellular News
New York Times
The Singapore dollar will strengthen 2.1% to S$1.41 over the next 12 months, and Taiwan's dollar will gain 4.4%to NT$31.5, economists led by Hong Kong-based Michael Buchanan wrote in a report.
Bloomberg
Wall Street Journal
Reg Hardware
AFP (via Google)
San Francisco Chronicle
New York Times
Novellus Systems narrowed the range of its expected third-quarter per-share loss to US$0.09 to break-even, from US$0.15 to break-even, as conditions in the semiconductor sector continue to improve.
Wall Street Journal
The antitrust trial between memory chip designer Rambus and several chip makers, including Micron Technology, has been postponed, according to reports.
Idaho Business Review
A new Microelectronics Innovation Center is being formed at the Université de Sherbrooke in Bromont, Québec, to focus on 200mm MEMS and 3D wafer-level packaging, and advanced technologies associated with the assembly and packaging of silicon chips.
Small Times
Hitachi researchers have developed a method to form cavities in the interconnect layers of CMOS ICs, allowing MEMS sensors to be created in the wiring layers.
Semiconductor International
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